Patents by Inventor Ying-Lin PAN

Ying-Lin PAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Board-warping measuring apparatus and board-warping measuring method thereof
    Patent number: 9423242
    Abstract: A board-warping measuring method is configured to measure a device under test. The device under test is disposed on a measuring carrier. The board-warping measuring method includes: projecting a pattern onto the device under test, wherein the pattern includes plural reference points; capturing a measurement image by an image-capturing module when the pattern is projected onto the device under test, wherein the measurement image includes plural measurement points respectively corresponding to the reference points; calculating a position of each of the measurement points in the measurement image by utilizing a transfer function corresponding to each of the reference points to obtain position heights of the device under test corresponding to the measurement points; and compensating for board warping of the device under test based on the position heights of the device under test corresponding to the measurement points.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: August 23, 2016
    Assignee: Test Research, Inc.
    Inventors: Liang-Pin Yu, Ying-Lin Pan, Chi-Yang Lin
  • BOARD-WARPING MEASURING APPARATUS AND BOARD-WARPING MEASURING METHOD THEREOF
    Publication number: 20160209206
    Abstract: A board-warping measuring method is configured to measure a device under test. The device under test is disposed on a measuring carrier. The board-warping measuring method includes: projecting a pattern onto the device under test, wherein the pattern includes plural reference points; capturing a measurement image by an image-capturing module when the pattern is projected onto the device under test, wherein the measurement image includes plural measurement points respectively corresponding to the reference points; calculating a position of each of the measurement points in the measurement image by utilizing a transfer function corresponding to each of the reference points to obtain position heights of the device under test corresponding to the measurement points; and compensating for board warping of the device under test based on the position heights of the device under test corresponding to the measurement points.
    Type: Application
    Filed: April 23, 2015
    Publication date: July 21, 2016
    Inventors: Liang-Pin YU, Ying-Lin PAN, Chi-Yang LIN