Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A method of manufacturing a cover structure is provided. A metal substrate disposed on a carrier is provided. The carrier has a surface, and the metal substrate has a plurality of openings exposing a portion of the surface. A first metal layer is formed on the metal substrate and is conformal with the metal substrate. The first metal layer covers the portion of the surface exposed by the openings. An insulating layer and a second metal layer located on the insulating layer are laminated on the metal substrate. The insulating layer is located between the first metal layer and the second metal layer to cover the first metal layer and fill the openings. The metal substrate and the carrier are removed to expose the first metal layer and define a plurality of cavity regions and a plurality of connecting regions connected with the cavity regions.

Abstract: A method of manufacturing a cover structure is provided. A metal substrate disposed on a carrier is provided. The carrier has a surface, and the metal substrate has a plurality of openings exposing a portion of the surface. A first metal layer is formed on the metal substrate and is conformal with the metal substrate. The first metal layer covers the portion of the surface exposed by the openings. An insulating layer and a second metal layer located on the insulating layer are laminated on the metal substrate. The insulating layer is located between the first metal layer and the second metal layer to cover the first metal layer and fill the openings. The metal substrate and the carrier are removed to expose the first metal layer and define a plurality of cavity regions and a plurality of connecting regions connected with the cavity regions.

Abstract: Interconnect feed devices (10) are provided for electrically connecting first and second electrical components (17, 21). The interconnect feed devices (10) can include a dielectric shell (23) with an electrically-conductive coating (40), and leads (22) positioned within individual conduits (30) of the shell. Each lead (22) and its associated conduit (30) can act as a coaxial cable for transmitting radio frequency (RF) energy between the first and second electrical components (17, 21). The shell (23) can be manufactured using a process, such as stereolithography, that allows the shell to be formed with relatively complicated geometries, which in turn can facilitate relatively complicated cable routing.

Abstract: A method of packing and transporting televisions includes placing a television into a protective box in a manufacturing district, in which the television is produced. The television and the protective box are transferred from the manufacturing district to a delivery address. The television is taken out of the protective box and is set-up at the delivery address. The protective box is transferred from the delivery address back to the manufacturing district, and is used to pack and transfer another television.

Abstract: Interconnect feed devices (10) are provided for electrically connecting first and second electrical components (17, 21). The interconnect feed devices (10) can include a dielectric shell (23) with an electrically-conductive coating (40), and leads (22) positioned within individual conduits (30) of the shell. Each lead (22) and its associated conduit (30) can act as a coaxial cable for transmitting radio frequency (RF) energy between the first and second electrical components (17, 21). The shell (23) can be manufactured using a process, such as stereolithography, that allows the shell to be formed with relatively complicated geometries, which in turn can facilitate relatively complicated cable routing.

Abstract: A circuit card clamp (300) including a base member (316), at least one first wedge member (446), and a thermally conductive membrane (350). The base member has an elongated shape configured for insertion in a circuit card chassis slot (106). The first wedge member is movable relative to the base member in response to a first actuator (304) for engaging the circuit card chassis slot. The thermally conductive membrane is coupled to the base member and the first wedge member. The thermally conductive membrane has slack for permitting the first wedge member to move relative to the base member between a first clamped position and a second unclamped position. The thermally conductive membrane defines a thermal conductive path (206) between a circuit card (104) and the chassis slot for releasably securing a circuit card in the circuit card chassis slot.

Abstract: A circuit card clamp (300) including a base member (316), at least one first wedge member (446), and a thermally conductive membrane (350). The base member has an elongated shape configured for insertion in a circuit card chassis slot (106). The first wedge member is movable relative to the base member in response to a first actuator (304) for engaging the circuit card chassis slot. The thermally conductive membrane is coupled to the base member and the first wedge member. The thermally conductive membrane has slack for permitting the first wedge member to move relative to the base member between a first clamped position and a second unclamped position. The thermally conductive membrane defines a thermal conductive path (206) between a circuit card (104) and the chassis slot for releasably securing a circuit card in the circuit card chassis slot.

Abstract: A fabricating process of a circuit board with an embedded passive component is described. First, a conductive layer including a first surface and a second surface opposite thereto is provided. The first surface has at least one component region on which at least one passive component material layer is formed. A passivation layer is formed on the first surface to cover the passive component material layer. A brown oxidation process is performed on the conductive layer. A circuit unit and an insulation layer are provided, and the insulation layer is set between the circuit unit and the conductive layer. The conductive layer, the circuit unit and the insulation layer are laminated. The passive component material layer is between the insulation layer and the conductive layer. The conductive layer is patterned to form a circuit layer.

Abstract: A cam activated circuit card clamp is provided. The circuit card clamp is comprised of a base member (204), a leverage arm (412), and a cam activation shaft (422). The circuit card clamp is also comprised of one or more cams (410-1, 410-2, 410-3, 410-4), one or more ramp members (308-1, 308-2, 308-3, 308-4), and one or more wedge members (418-1, 418-2, 418-3, 418-4). The cam activation shaft is coupled to the leverage arm. The cams are in contact with the cam activation shaft which has one or more compression springs disposed thereon. The cams are adapted to pivot about a pivot shaft when actuated. The cams also have a surface adapted to engage an adjacent wedge member when actuated. Each ramp member has an inclined surface adapted to deflect an adjacent wedge member when the adjacent wedge member is compressed against the ramp member. Each wedge member has a surface adapted to engage an adjacent cam.

Abstract: A cam activated circuit card clamp is provided. The circuit card clamp is comprised of a base member (204), a leverage arm (412), and a cam activation shaft (422). The circuit card clamp is also comprised of one or more cams (410-1, 410-2, 410-3, 410-4), one or more ramp members (308-1, 308-2, 308-3, 308-4), and one or more wedge members (418-1, 418-2, 418-3, 418-4). The cam activation shaft is coupled to the leverage arm. The cams are in contact with the cam activation shaft which has one or more compression springs disposed thereon. The cams are adapted to pivot about a pivot shaft when actuated. The cams also have a surface adapted to engage an adjacent wedge member when actuated. Each ramp member has an inclined surface adapted to deflect an adjacent wedge member when the adjacent wedge member is compressed against the ramp member. Each wedge member has a surface adapted to engage an adjacent cam.

Abstract: System for dynamically tracking a position of a target with an antenna in a communication system. The system includes an antenna system (410) configured for generating a sum and difference antenna pattern (201-1, 201-2). A sum RF channel (401) is coupled to a sum channel output of the antenna system. A difference RF channel (402) is coupled to a difference channel output of the antenna system. An RF coupler (422-1) is provided that has a first input coupled to the sum RF channel and a second input coupled to the RF difference channel. One or more coupling control devices (418-1, 418-2) selectively vary an effective coupling value as between the difference channel and the sum channel. An antenna tracking error signal is generated at an output of the coupler.

Abstract: A ruggedized, snap-together, module securely retains a pair of mutually abutting fiber optic interconnect MT ferrules, that have been joined together by a ferrule aligning pin clamp structure. The module includes a generally rectangular base member having a ferrule retention cavity that is configured to retain a pair of MT ferrules and an associated pin clamp assembly therefor. A cover is configured to engage the base in such a manner that the two MT ferrules are firmly held in their intended face-to-face abutting condition as captured between the base and the cover. A bias compression spring is captured between the cover and the base in a manner that facilitates removal of the cover when it is desired to open the module and gain access to the two MT ferrules.

Abstract: A ruggedized, snap-together, module securely retains a pair of mutually abutting fiber optic interconnect MT ferrules, that have been joined together by a ferrule aligning pin clamp structure. The module includes a generally rectangular base member having a ferrule retention cavity that is configured to retain a pair of MT ferrules and an associated pin clamp assembly therefor. A cover is configured to engage the base in such a manner that the two MT ferrules are firmly held in their intended face-to-face abutting condition as captured between the base and the cover. A bias compression spring is captured between the cover and the base in a manner that facilitates removal of the cover when it is desired to open the module and gain access to the two MT ferrules.

Abstract: A vibration tolerant electronic assembly may include a base and a first isolation stage including a first frame, at least one first linear bearing coupling the first frame to the base to constrain movement of the first frame along a first coordinate axis, and at least one first damper for damping movement of the first frame. A second similar isolation stage may be coupled to the first isolation stage, and a third similar isolation stage may be coupled to the second isolation stage. Furthermore, an electronic device may be coupled to the third isolation stage. The electronic assembly provides resistance to disturbance of the electronic device by vibration in one or more of three coordinate axis.

Abstract: A vibration tolerant electronic assembly may include a base and a first isolation stage including a first frame, at least one first linear bearing coupling the first frame to the base to constrain movement of the first frame along a first coordinate axis, and at least one first damper for damping movement of the first frame. A second similar isolation stage may be coupled to the first isolation stage, and a third similar isolation stage may be coupled to the second isolation stage. Furthermore, an electronic device may be coupled to the third isolation stage. The electronic assembly provides resistance to disturbance of the electronic device by vibration in one or more of three coordinate axis.

Abstract: A vibration tolerant electronic assembly may include a base and a first isolation stage including a first frame, at least one first linear bearing coupling the first frame to the base to constrain movement of the first frame along a first coordinate axis, and at least one first damper for damping movement of the first frame. A second similar isolation stage may be coupled to the first isolation stage, and a third similar isolation stage may be coupled to the second isolation stage. Furthermore, an electronic device may be coupled to the third isolation stage. The electronic assembly provides resistance to disturbance of the electronic device by vibration in one or more of three coordinate axis.