Abstract: An epoxy-containing siloxane-modified resin, a package material, and a package structure are provided. The epoxy-containing siloxane-modified resin is formed by reacting a hydroxy terminated siloxane compound with a siloxane resin, and then reacting with an epoxy silane. The hydroxy terminated siloxane compound and the siloxane resin have a molar ratio of 5:1 to 10:1, and the epoxy silane and the siloxane resin have a molar ratio of 2:1 to 4:1.

Abstract: An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.

Abstract: An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.

Abstract: An organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same are disclosed. The organic-inorganic hybrid resin is a reaction product of a composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), and 100 parts by weight of reactant (b). In particular, the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and the metal oxide cluster includes Ti, Zr, Zn, or a combination thereof. The reactant (b) includes an epoxy resin.

Abstract: A siloxane resin and photoelectric device employing the same are provided. The siloxane resin composition includes (a) 45-87 parts by weight of a first siloxane compound represented by Formula (I), wherein each R1 is independently C1-3 alkyl group, and n is an integer from 2 to 15; (b) 5-35 parts by weight of a second siloxane compound represented by Formula (II), wherein each R2 and R3 are independently C1-3 alkyl group; each R4 is independently C1-3 alkyl group, or epoxy group; x?1, y?2, and x/y is from about 0.

Abstract: An organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same are disclosed. The organic-inorganic hybrid resin is a reaction product of a composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), and 100 parts by weight of reactant (b). In particular, the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and the metal oxide cluster includes Ti, Zr, Zn, or a combination thereof. The reactant (b) includes an epoxy resin.

Abstract: A method for preparing a nanometal-polymer composite conductive film includes the steps of (1) mixing a metal oxide with a polymer solution; (2) coating a substrate with a solution resulting from step (1), followed by drying the resultant solution to form a film; (3) performing thermal treatment on the film formed in step (2); and (4) sintering the film thermally treated in step (3). The method dispenses with any reducing agent or dispersing agent but allows nanometallic particles to be formed in situ and thereby reduces surface resistance of the polymer film efficiently.

Abstract: A phosphorous flame retardant including nanosilicate platelets (NSP) is made by first reacting hexachlorotriphosphazene (HCP) with poly(oxyalkylene)amine, then mixing the HCP product with nano silicate platelets (NSP) to obtain the phosphorous flame retardant including NSP. The phosphorous flame retardant can be further applied to an epoxy resin as a curing agent.

Abstract: A method for preparing a nanometal-polymer composite conductive film includes the steps of (1) mixing a metal oxide with a polymer solution; (2) coating a substrate with a solution resulting from step (1), followed by drying the resultant solution to form a film; (3) performing thermal treatment on the film formed in step (2); and (4) sintering the film thermally treated in step (3). The method dispenses with any reducing agent or dispersing agent but allows nanometallic particles to be formed in situ and thereby reduces surface resistance of the polymer film efficiently.