Abstract: The disclosed relates to a hybrid traffic flow motion behavior modeling method based on an inference graph, wherein the method comprises: obtaining scene information, representing all traffic participants in the scene as vertices, and using directed edges to represent interaction relationships among traffic participants, so as to obtain the interaction graph; obtaining all possible interaction situations according to the interaction graph; based on each possible interaction situation, estimating the trajectory of each traffic participant in the interaction situation, and judging whether the trajectory conforms to a preset empirical decision-making criteria, so as to judge rationality of the interaction situation; and judging the rationality of all possible interaction situations obtained in the interaction situation generation step in turn until an interaction situation satisfying the rationality is found, and taking a trajectory of each traffic participant corresponding to the interaction situation as a fina

Abstract: The disclosed relates to a hybrid traffic flow motion behavior modeling method based on an inference graph, wherein the method comprises: obtaining scene information, representing all traffic participants in the scene as vertices, and using directed edges to represent interaction relationships among traffic participants, so as to obtain the interaction graph; obtaining all possible interaction situations according to the interaction graph; based on each possible interaction situation, estimating the trajectory of each traffic participant in the interaction situation, and judging whether the trajectory conforms to a preset empirical decision-making criteria, so as to judge rationality of the interaction situation; and judging the rationality of all possible interaction situations obtained in the interaction situation generation step in turn until an interaction situation satisfying the rationality is found, and taking a trajectory of each traffic participant corresponding to the interaction situation as a fina

Abstract: A pharmaceutical composition containing F1 polypeptide and/or F3 polypeptide and a use thereof are provided. The pharmaceutical composition is made into a common dosage form, such as an emulsion and an ointment, and used for treating a disease, such as a wart associated with a HPV infection, or a solid tumor associated with or not associated with the HPV infection.

Abstract: A pharmaceutical composition containing F1 polypeptide and/or F3 polypeptide and a use thereof are provided. The pharmaceutical composition is made into a common dosage form, such as an emulsion and an ointment, and used for treating a disease, such as a wart associated with a HPV infection, or a solid tumor associated with or not associated with the HPV infection.

Abstract: An integrated circuit (IC) package includes an IC chip and a package carrier. The IC chip includes a substrate and an IC layered structure configured on an active surface of the substrate. The IC layered structure includes a first physical layer interface and a second physical layer interface. The first physical layer interface includes a plurality of first bump pads and a plurality of first inner pads electrically connected to the first bump pads, respectively. The second physical layer interface includes a plurality of second bump pads and a plurality of second inner pads electrically connected to the second bump pads, respectively. The second bump pads are mirror images of the first bump pads with respect to a first geometric plane perpendicular to the active surface. The second inner pads are mirror images of the first inner pads with respect to the first geometric plane.

Abstract: An integrated circuit (IC) package includes an IC chip and a package carrier. The IC chip includes a substrate and an IC layered structure configured on an active surface of the substrate. The IC layered structure includes a first physical layer interface and a second physical layer interface. The first physical layer interface includes a plurality of first bump pads and a plurality of first inner pads electrically connected to the first bump pads, respectively. The second physical layer interface includes a plurality of second bump pads and a plurality of second inner pads electrically connected to the second bump pads, respectively. The second bump pads are mirror images of the first bump pads with respect to a first geometric plane perpendicular to the active surface. The second inner pads are mirror images of the first inner pads with respect to the first geometric plane.

Abstract: An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact surface, while the arrangement of non-signal through vias includes first non-signal through vias and a second non-signal through via. The first non-signal through vias pass through the core layer and are electrically connected to some of the contact pads. The second non-signal through via which passes through the core layer is disposed between the first non-signal through vias and is not electrically connected to the contact pads. The interval between the second non-signal through via and anyone of the surrounding first non-signal through vias is smaller than or equal to 0.72 times of the minimum interval between any two of the contact pads electrically connected to the corresponding first non-signal through vias.

Abstract: An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact surface, while the arrangement of non-signal through vias includes first non-signal through vias and a second non-signal through via. The first non-signal through vias pass through the core layer and are electrically connected to some of the contact pads. The second non-signal through via which passes through the core layer is disposed between the first non-signal through vias and is not electrically connected to the contact pads. The interval between the second non-signal through via and anyone of the surrounding first non-signal through vias is smaller than or equal to 0.72 times of the minimum interval between the second non-signal through via and one of the contact pads electrically connected to the corresponding first non-signal through vias.

Abstract: A light emitting diode and a method for manufacturing the same are provided. The light emitting diode includes: a transparent substrate made of AlxGa1-xAs; a light emitting layer made of AlGaInP, stacked on the transparent substrate, and having a multiple layered epitaxially growing structure; a window layer made of GaP, stacked on the light emitting layer, and having a transparent structure with a great bandgap; an upper electrode layer overlying the window layer; and a lower electrode layer underlying the transparent substrate, wherein the x-value in AlxGa1-xAs is set to corresponding to the emission wavelengths of the light emitting layer so that the transparent substrate can have a great bandgap which make it to be transparent to the light emitted by the light emitting layer; and a window layer is used to increase the current diffusion from the upper electrode layer to the light emitting layer.