Abstract: A portal pile driver, and a cast-in-place pile construction method are provided, relating to the technical field of pile foundation construction. The portal pile driver includes a portal frame, a pile frame platform, a moving assembly, and a lifting assembly. The portal frame is erected at one side of the pile frame platform, and a power head is installed on the portal frame. A loading zone is located at the pile frame platform, and a projection of a central shaft of the power head on the pile frame platform is located in an extension direction of the loading zone. The moving assembly is located at one side or each of both sides of the loading zone, and multiple drill pipes are horizontally distributed on the moving assembly, and each drill pipe is perpendicular to a plane where the portal frame is located.

Abstract: A method of manufacturing an interconnect structure includes forming an opening through a dielectric layer. The opening exposes a top surface of a first conductive feature. The method further includes forming a barrier layer on sidewalls of the opening, passivating the exposed top surface of the first conductive feature with a treatment process, forming a liner layer over the barrier layer, and filling the opening with a conductive material. The liner layer may include ruthenium.

Abstract: A method of manufacturing an interconnect structure includes forming an opening through a dielectric layer. The opening exposes a top surface of a first conductive feature. The method further includes forming a barrier layer on sidewalls of the opening, passivating the exposed top surface of the first conductive feature with a treatment process, forming a liner layer over the barrier layer, and filling the opening with a conductive material. The liner layer may include ruthenium.

Abstract: Various back end of line (BEOL) layer formation techniques described herein enable reduced contact resistance, reduced surface roughness, and/or increased semiconductor device performance for BEOL layers such as interconnects and/or metallization layers.

Abstract: A synthesis and an application of a phosphatase degrader are provided. The phosphatase degrader is a compound represented by formula I, or a salt thereof, or a deuterated compound thereof, or a stereoisomer thereof, or a solvate thereof, or a hydrate thereof, or a prodrug thereof. The compound can be used as a phosphatase degrader, especially as an SHP2 protein degrader, can treat malignant diseases such as tumors, and has good application prospects.

Abstract: The present disclosure provides a method and a device for changing a data transmission process, and a processor-readable storage medium. The method includes transmitting, by a first wireless transceiver device, first information to a second wireless transceiver device through a physical layer. The first information includes indication information indicating a to-be-changed target data transmission process or a triggering factor corresponding to a transmission service.

Abstract: The present disclosure provides a method and a device for changing a data transmission process, and a processor-readable storage medium. The method includes transmitting, by a first wireless transceiver device, first information to a second wireless transceiver device through a physical layer. The first information includes indication information indicating a to-be-changed target data transmission process or a triggering factor corresponding to a transmission service.

Abstract: Provided are a screenshot method, an electronic device and a storage medium. In the method, in response to a screenshot operation, a screenshot of each of multiple display windows displayed on a screen is separately acquired as a first screenshot, to obtain first screenshots of the multiple display windows. At least one second screenshot, each being a screenshot of at least two display windows of the multiple of display windows, is acquired. The first screenshot and the at least one second screenshot are displayed in a preview mode. In response to a selection operation for a target screenshot of the screenshots displayed in the preview mode, the target screenshot is saved. (FIG.

Abstract: A method, a communication device, an apparatus, and a storage medium for measuring and feeding back delay information. The method comprises: receiving, by a reception terminal, a physical layer signal or channel that is transmitted by a transmission terminal and carries clock reference information corresponding to a service to be transmitted, wherein the clock reference information represents reference arrival time of the service to be transmitted to the reception terminal; demodulating, by the reception terminal, the physical layer signal or channel, obtaining, by the reception terminal, the clock reference information, and determining, by the reception terminal, corresponding delay information at least based on the clock reference information and actual arrival time of the physical layer signal or channel; and feeding back, by the reception terminal, the delay information to a target terminal.

Abstract: A current sense short protection circuit includes a switch unit, a current sensing unit, a detection circuit and a short detection module. The first terminal of the switch unit receives a first voltage. The control terminal of the switch unit receives a control signal. The first terminal of the current sensing unit is coupled to the second terminal of the switch unit. The second terminal of the current sensing unit receives a second voltage. The detection unit receives the second voltage and a third voltage provided by the first terminal of the current sensing unit, and generates a detection signal according to the second voltage and the third voltage. The short detection module receives the first voltage, the second voltage and the detection signal, and generates a short detection signal according to the first voltage, the second voltage and the detection signal.

Abstract: Some implementations described herein provide a deposition tool that includes a grounding component between an edge ring of a substrate stage and a pumping plate component. The grounding component includes a grounding strap having a deformation region. The deformation region includes a recessed edge to reduce a likelihood of the grounding strap rubbing against a surface of the pumping plate component during operation of the deposition tool. Material properties of the grounding strap may reduce a likelihood of plastic deformation of the grounding strap during repeated cycling. In this way, an amount of particulates dislodged from the surface of the pumping plate component may be decreased to improve a yield of semiconductor product fabricated using the deposition tool. Furthermore, a frequency of servicing the grounding component may be decreased to decrease a downtime of the deposition tool and increase a throughput of semiconductor product fabricated using the deposition tool.

Abstract: A method of manufacturing an interconnect structure includes forming an opening through a dielectric layer. The opening exposes a top surface of a first conductive feature. The method further includes forming a barrier layer on sidewalls of the opening, passivating the exposed top surface of the first conductive feature with a treatment process, forming a liner layer over the barrier layer, and filling the opening with a conductive material.

Abstract: A method for adjusting display colors, an electronic device, and a storage medium are provided. The method includes: in response to a selection operation acting on color blocks, the color blocks are filled to controls to be filled; and upon detecting that the color blocks are all filled to the controls to be filed, the display colors are adjusted on the basis of a relationship between arrangement orders and preset arrangement orders. By adjusting the display colors of the electronic device according to a test result, personalization of the display color is achieved, and the user experience is improved.

Abstract: Various back end of line (BEOL) layer formation techniques described herein enable reduced contact resistance, reduced surface roughness, and/or increased semiconductor device performance for BEOL layers such as interconnects and/or metallization layers.

Abstract: A scam detection system includes a user computer that runs a security application and a backend system that runs a scam detector. An email is received at the user computer. The security application extracts and forwards a content of the email, which includes a body of the email, to the backend system. The email body of the email is anonymized by removing personally identifiable information from the email body. A hash of the anonymized email body is generated and compared against hashes of a whitelist and a blacklist. The anonymized email body is classified. A segment of text of the anonymized email body is identified and provided to the user computer when the anonymized email body is classified as scam.

Abstract: A method of manufacturing an interconnect structure includes forming an opening through a dielectric layer. The opening exposes a top surface of a first conductive feature. The method further includes forming a barrier layer on sidewalls of the opening, passivating the exposed top surface of the first conductive feature with a treatment process, forming a liner layer over the barrier layer, and filling the opening with a conductive material. The liner layer may include ruthenium.

Abstract: An earphone module includes a first circuit board. The first circuit board includes a touch panel layer, a grounding layer, an antenna layer and a touch circuit layer assembly. The grounding layer is disposed apart from and below the touch panel layer. The antenna layer includes an antenna flat portion, an antenna feed wire and an antenna short-circuit wire. The antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion. The touch circuit layer assembly is disposed apart from and below the antenna flat portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip.

Abstract: A unicast connection establishment method for a direct link, a terminal and a device are provided, the method is applied to a first terminal and includes the following steps: determining, according to status information of at least one second terminal, one terminal of the at least one second terminal as a target terminal for a unicast communication of a direct link; and establishing a unicast connection of the direct link with the target terminal, and determining transmission configuration information for performing a unicast data communication with the target terminal.

Abstract: An earphone module includes a first circuit board. The first circuit board includes a touch panel layer, a grounding layer, an antenna layer and a touch circuit layer assembly. The grounding layer is disposed apart from and below the touch panel layer. The antenna layer includes an antenna flat portion, an antenna feed wire and an antenna short-circuit wire. The antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion. The touch circuit layer assembly is disposed apart from and below the antenna flat portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip.

Abstract: Disclosed by the present application are a method and device for selecting resources in a carrier wave, the method includes that according to the service requirements for a service to be sent, determining available resources in a carrier wave that supports the service to be sent that satisfy the service requirements; and forming a resource pool by means of the available resources; and selecting from the resource pool a target resource that is used to send the service to be sent.