Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a circuit board, a barrier structure and a molding layer. The circuit board includes a substrate and a component disposed on the substrate. The substrate includes a molding area and a non-molding area, and the component is disposed on the molding area. The barrier structure is disposed on the substrate and located between the molding area and the non-molding area. The barrier structure has a first predetermined height. The molding layer is disposed on the molding area and covers the component. The molding layer has a second predetermined height. The first predetermined height of the barrier structure is less than or equal to the second predetermined height of the molding layer.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a circuit board, a barrier structure and a molding layer. The circuit board includes a substrate and a component disposed on the substrate. The substrate includes a molding area and a non-molding area, and the component is disposed on the molding area. The barrier structure is disposed on the substrate and located between the molding area and the non-molding area. The barrier structure has a first predetermined height. The molding layer is disposed on the molding area and covers the component. The molding layer has a second predetermined height. The first predetermined height of the barrier structure is less than or equal to the second predetermined height of the molding layer.

Abstract: A package device and a method for fabricating thereof are provided. The package device includes a substrate, a redistribution structure, a circuit board structure, a plurality of first connectors and a first electronic component. The redistribution structure is disposed over the substrate. The redistribution structure includes a first dielectric layer and a first metal layer. The circuit board structure disposed over the redistribution structure. The circuit board structure includes a second dielectric layer and a second metal layer. The second dielectric layer of the circuit board structure has a plurality of protrusions embedded in the first dielectric layer of the redistribution structure. A first electronic component is disposed on the redistribution structure, and the first connectors are interposed between the redistribution structure and the first electronic component to interconnect the two.