Patents by Inventor YING-QIU ZHENG

YING-QIU ZHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230047768
    Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
    Type: Application
    Filed: November 2, 2022
    Publication date: February 16, 2023
    Inventors: YING-QIU ZHENG, CHAO PENG, XIAN-QIN HU
  • Circuit board and method for manufacturing the same
    Patent number: 11523517
    Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: December 6, 2022
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Ying-Qiu Zheng, Chao Peng, Xian-Qin Hu
  • CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20220046802
    Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
    Type: Application
    Filed: September 30, 2020
    Publication date: February 10, 2022
    Inventors: YING-QIU ZHENG, CHAO PENG, XIAN-QIN HU