Patents by Inventor Ying-Shen Kuo

Ying-Shen Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11791153
    Abstract: Methods for forming hafnium oxide within a three-dimensional structure, such as in a high aspect ratio hole, are provided. The methods may include depositing a first hafnium-containing material, such as hafnium nitride or hafnium carbide, in a three-dimensional structure and subsequently converting the first hafnium-containing material to a second hafnium-containing material comprising hafnium oxide by exposing the first hafnium-containing material to an oxygen reactant. The volume of the second hafnium-containing material may be greater than that of the first hafnium-containing material. Voids or seams formed during the deposition of the first hafnium-containing material in the three-dimensional structure may be filled by the expanded material after exposing the first hafnium-containing material to the oxygen reactant. Thus, the three-dimensional structure, such as a high aspect ratio hole, can be filled with hafnium oxide substantially free of voids or seams.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: October 17, 2023
    Assignee: ASM IP Holding B.V.
    Inventors: Jiyeon Kim, Petri Raisanen, Sol Kim, Ying-Shen Kuo, Michael Schmotzer, Eric James Shero, Paul Ma
  • Publication number: 20220349051
    Abstract: A reaction system including a chemical storage assembly in fluid communication with both a remote plasma unit and a bypass line for providing both a plasma activated cleaning species and a non-plasma activated cleaning species to a reaction chamber.
    Type: Application
    Filed: April 26, 2022
    Publication date: November 3, 2022
    Inventors: Amit Mishra, Jereld Lee Winkler, Moataz Bellah Mousa, Mustafa Muhammad, Paul Ma, Hichem M'Saad, Ying-Shen Kuo, Chad Lunceford, Shuaidi Zhang
  • Publication number: 20210249263
    Abstract: Methods for forming hafnium oxide within a three-dimensional structure, such as in a high aspect ratio hole, are provided. The methods may include depositing a first hafnium-containing material, such as hafnium nitride or hafnium carbide, in a three-dimensional structure and subsequently converting the first hafnium-containing material to a second hafnium-containing material comprising hafnium oxide by exposing the first hafnium-containing material to an oxygen reactant. The volume of the second hafnium-containing material may be greater than that of the first hafnium-containing material. Voids or seams formed during the deposition of the first hafnium-containing material in the three-dimensional structure may be filled by the expanded material after exposing the first hafnium-containing material to the oxygen reactant. Thus, the three-dimensional structure, such as a high aspect ratio hole, can be filled with hafnium oxide substantially free of voids or seams.
    Type: Application
    Filed: February 8, 2021
    Publication date: August 12, 2021
    Inventors: Jiyeon Kim, Petri Raisanen, Sol Kim, Ying-Shen Kuo, Michael Schmotzer, Eric James Shero, Paul Ma