Patents by Inventor Ying-Sheng Lin

Ying-Sheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surface
    Patent number: 9070536
    Abstract: Undesirable heating of a semiconductor process ring is prevented by thermally isolating the process ring from the insulating puck of an electrostatic chuck, and providing a thermally conductive and electrically insulating thermal ring contacting both the semiconductor process ring and an underlying metal base having internal coolant flow passages.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: June 30, 2015
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Michael D. Willwerth, David Palagashvili, Michael G. Chafin, Ying-Sheng Lin
  • PRESSURE CONTROLLER CONFIGURATION FOR SEMICONDUCTOR PROCESSING APPLICATIONS
    Publication number: 20140311581
    Abstract: An exemplary semiconductor processing system may include a processing chamber and a first pressure regulating device coupled with the processing chamber. A second pressure regulating device may also be coupled with the processing chamber separate from the first pressure regulating device. A first pump may be fluidly coupled with the first pressure regulating device and fluidly isolated from the second pressure regulating device. A second fluid pump may be fluidly coupled with the second pressure regulating device.
    Type: Application
    Filed: June 17, 2013
    Publication date: October 23, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Sergey G. Belostotskiy, Andrew Nguyen, Jonathan Dinh, Ying-Sheng Lin
  • DEPOSITION SHIELD FOR PLASMA ENHANCED SUBSTRATE PROCESSING
    Publication number: 20140151331
    Abstract: Methods and apparatus for plasma processing of substrates are provided herein. In some embodiments, a deposition shield for use in processing a substrate having a given width may include a first plate having a first plurality of holes disposed through a thickness of the first plate; and a second plate disposed below the first plate and having a second plurality of holes disposed through a thickness of the second plate, wherein individual holes in the first plurality of holes and the second plurality of holes are not aligned.
    Type: Application
    Filed: February 27, 2013
    Publication date: June 5, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: VALENTIN N. TODOROW, MICHAEL D. WILLWERTH, YING-SHENG LIN, DAVID PALAGASHVILI
  • PLASMA REACTOR ELECTROSTATIC CHUCK WITH COOLED PROCESS RING AND HEATED WORKPIECE SUPPORT SURFACE
    Publication number: 20130277339
    Abstract: Undesirable heating of a semiconductor process ring is prevented by thermally isolating the process ring from the insulating puck of an electrostatic chuck, and providing a thermally conductive and electrically insulating thermal ring contacting both the semiconductor process ring and an underlying metal base having internal coolant flow passages.
    Type: Application
    Filed: October 1, 2012
    Publication date: October 24, 2013
    Inventors: Michael D. Willwerth, David Palagashvili, Michael G. Chafin, Ying-Sheng Lin
  • Metal display casing and display thereof
    Publication number: 20100309619
    Abstract: A metal display casing is disclosed, which includes a base plate having an edge, a bending portion extended from the edge, a fold-back portion connected to the bending portion, and a screw hole disposed on the fold-back portion. A display utilizing the metal display casing is also disclosed.
    Type: Application
    Filed: August 31, 2009
    Publication date: December 9, 2010
    Applicant: Quanta Computer Inc.
    Inventors: Steve Cheng, Chin-Fa Chang, Mao-Chen Hsiao, Ying-Sheng Lin