Abstract: A piezoelectric ceramic speaker includes a conductive plate and a round piezoelectric ceramic sheet. The conductive plate has notches and sound delivering holes. The round piezoelectric ceramic plate is stacked on a central region of the conductive plate. The notches are opened on a periphery region of the conductive plate and partly extended toward the central region. The notches are equiangularly arranged on the conductive plate with respect to the center of the conductive plate. Accordingly, auxiliary fixtures can pass through the notches to position the conductive plate. Hence, the conductive plate can be positioned by the fixtures during manufacturing processes. Consequently, the piezoelectric ceramic speaker can be mass produced with good yield rates. Additionally, since the round piezoelectric ceramic plate and the conductive plate are coaxially arranged, a dual-band earphone having the piezoelectric ceramic speaker can provide a better sound resolution performance.

Abstract: The earphone with inverse sound waves includes an earphone housing, a high frequency driver, and a low frequency driver. The earphone housing includes an inner space, a sound output portion, and a reflecting portion. The reflecting portion receives a passive diaphragm. The high frequency driver produces high frequency sound waves and has a sound output direction toward the sound output opening. The low frequency driver is mounted in the inner space of the earphone housing by a mounting brace. The low frequency driver is located between the high frequency driver and the passive diaphragm. A sound transmitting portion is formed between the mounting brace and the earphone housing. The low frequency driver produces low frequency sound waves and has a sound output direction toward the passive diaphragm. The passive diaphragm reflects the low frequency sound waves to the sound output opening via the sound transmitting portion.

Abstract: A piezoelectric ceramic speaker includes a conductive plate and a round piezoelectric ceramic sheet. The conductive plate has notches and sound delivering holes. The round piezoelectric ceramic plate is stacked on a central region of the conductive plate. The notches are opened on a periphery region of the conductive plate and partly extended toward the central region. The notches are equiangularly arranged on the conductive plate with respect to the center of the conductive plate. Accordingly, auxiliary fixtures can pass through the notches to position the conductive plate. Hence, the conductive plate can be positioned by the fixtures during manufacturing processes. Consequently, the piezoelectric ceramic speaker can be mass produced with good yield rates. Additionally, since the round piezoelectric ceramic plate and the conductive plate are coaxially arranged, a dual-band earphone having the piezoelectric ceramic speaker can provide a better sound resolution performance.

Abstract: The earphone with inverse sound waves includes an earphone housing, a high frequency driver, and a low frequency driver. The earphone housing includes an inner space, a sound output portion, and a reflecting portion. The reflecting portion receives a passive diaphragm. The high frequency driver produces high frequency sound waves and has a sound output direction toward the sound output opening. The low frequency driver is mounted in the inner space of the earphone housing by a mounting brace. The low frequency driver is located between the high frequency driver and the passive diaphragm. A sound transmitting portion is formed between the mounting brace and the earphone housing. The low frequency driver produces low frequency sound waves and has a sound output direction toward the passive diaphragm. The passive diaphragm reflects the low frequency sound waves to the sound output opening via the sound transmitting portion.

Abstract: A multiple speakers, including: A sound box has a long flat body and a long first voice face at front. Both sides of the first voice face incline separately to from a second voice face. A first speaker unit places inside the sound box including a left speaker and a right speaker that is placed separately at the left end and right end of the first voice face. A second speaker unit places inside the sound box including a left speaker and a right speaker that is placed separately at the left side and right side of the second voice face.

Abstract: A multi-channel headphone includes a case adapted to be worn on user's ear and cover the whole ear, in which a middle speaker, a front speaker, rear speaker and a bass speaker are provided. The front speaker has a broadcasting portion facing a front side of an auricle of the ear and the rear speaker has a broadcasting portion facing a rear side of the auricle. The headphone provides a sound closing to the idea surround sound.

Abstract: An improved and new apparatus and method for post chemical-mechanical planarization (CMP) cleaning has been developed. Use of a QDR (Quick Dump Rinse) DI water bath for receiving a cassette of semiconductor substrates from a previous CMP processing station, for keeping the semiconductor substrates submerged in DI water following CMP and before transmission to a next processing station and for performing at least one rinsing and dumping operation on the semiconductor substrates in flowing DI water greatly enhances the manufacturing throughput of the process, reduces the use of chemicals, and simplifies the tool requirements for the post-CMP cleaning process.

Abstract: An improved and new apparatus and method for post chemical-mechanical planarization (CMP) cleaning has been developed. Use of a QDR (Quick Dump Rinse) DI water bath for receiving a cassette of semiconductor substrates from a previous CMP processing station, for keeping the semiconductor substrates submerged in DI water following CMP and before transmission to a next processing station and for performing at least one rinsing and dumping operation on the semiconductor substrates in flowing DI water greatly enhances the manufacturing throughput of the process, reduces the use of chemicals, and simplifies the tool requirements for the post-CMP cleaning process.

Abstract: A method to prevent volcano effect in tungsten plug deposition is described. The method is applied to both the contact plugs as well as the via plugs. For these purposes, the use of a nitrogen (N.sub.2) plasma of a specific recipe is introduced. It is shown that the presence of the nitrogen plasma improves the titanium nitride (TiN) barrier layer through annealing, and nitrogen stuffing of the grain boundaries. In addition, a titanium (Ti) layer must be used prior to the deposition of the TiN layer in order to improve adhesion. This step also enhances the titanium nitride barrier, and reduces the contact resistance (R.sub.c) of the contact-plugs as well. Finally, the nitrogen plasma process and the metal deposition can be done in one and the same equipment.