Patents by Inventor Ying-Shih Lin

Ying-Shih Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package structure
    Patent number: 8405232
    Abstract: A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: March 26, 2013
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Hung Hsu, Huan-Wen Chen, Shih-Chieh Chiu, Ying-Shih Lin
  • CHIP PACKAGE STRUCTURE, CHIP PACKAGE MOLD CHASE AND CHIP PACKAGE PROCESS
    Publication number: 20110304062
    Abstract: A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.
    Type: Application
    Filed: September 16, 2010
    Publication date: December 15, 2011
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Hung Hsu, Huan-Wen Chen, Shih-Chieh Chiu, Ying-Shih Lin