Abstract: A method of forming a semiconductor package includes dispensing an adhesive on a substrate that has an integrated circuit die attached thereon, placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the adhesive, and pressing the lid against the substrate such that a portion of the adhesive is squeezed from a space between the bottom surface of the lid and the substrate onto a sidewall of the lid.

Abstract: A semiconductor device includes an electronic component, a package, a substrate and a plurality of first conductors and second conductors. The package is over the electronic component. T substrate is between the electronic component and the package. The substrate includes a first portion covered by the package, and a second portion protruding out of an edge of the package and uncovered by the package. The first conductors and second conductors are between and electrically connected to the electronic component and the substrate. A width of a second conductor of the plurality of second conductors is larger than a width of a first conductor of the plurality of first conductors, the first conductors are disposed between the second portion of the substrate and the electronic component, and the second conductors are disposed between the first portion of the substrate and the electronic component.

Abstract: A method of forming a semiconductor package includes dispensing an adhesive on a substrate that has an integrated circuit die attached thereon, placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the adhesive, and pressing the lid against the substrate such that a portion of the adhesive is squeezed from a space between the bottom surface of the lid and the substrate onto a sidewall of the lid.

Abstract: A semiconductor device includes an electronic component, a package, a substrate and a plurality of first conductors and second conductors. The package is over the electronic component. T substrate is between the electronic component and the package. The substrate includes a first portion covered by the package, and a second portion protruding out of an edge of the package and uncovered by the package. The first conductors and second conductors are between and electrically connected to the electronic component and the substrate. A width of a second conductor of the plurality of second conductors is larger than a width of a first conductor of the plurality of first conductors, the first conductors are disposed between the second portion of the substrate and the electronic component, and the second conductors are disposed between the first portion of the substrate and the electronic component.

Abstract: A semiconductor device includes a substrate, a package, first conductors and second conductors. The substrate includes a first surface and a second surface opposite to the first surface. The package is disposed over the substrate. The first conductors are disposed over the substrate. The second conductors are disposed over the substrate, wherein the first conductors and the second conductors are substantially at a same tier, and a width of the second conductor is larger than a width of the first conductor.

Abstract: A semiconductor package includes a substrate, an integrated circuit die, a lid and an adhesive. The integrated circuit die is disposed over the substrate. The lid is disposed over the substrate. The lid includes a cap portion and a foot portion extending from a bottom surface of the cap portion. The cap portion and the foot portion define a recess, and the integrated circuit die is accommodated in the recess. The adhesive includes a sidewall portion and a bottom portion. The sidewall portion contacts a sidewall of the foot portion. The bottom portion extends from the sidewall portion to between a bottom surface of the foot portion and the substrate.

Abstract: A semiconductor device includes a substrate, a package, first conductors and second conductors. The substrate includes a first surface and a second surface opposite to the first surface. The package is disposed over the substrate. The first conductors are disposed over the substrate. The second conductors are disposed over the substrate, wherein the first conductors and the second conductors are substantially at a same tier, and a width of the second conductor is larger than a width of the first conductor.

Abstract: A semiconductor package includes a substrate, an integrated circuit die, a lid and an adhesive. The integrated circuit die is disposed over the substrate. The lid is disposed over the substrate. The lid includes a cap portion and a foot portion extending from a bottom surface of the cap portion. The cap portion and the foot portion define a recess, and the integrated circuit die is accommodated in the recess. The adhesive includes a sidewall portion and a bottom portion. The sidewall portion contacts a sidewall of the foot portion. The bottom portion extends from the sidewall portion to between a bottom surface of the foot portion and the substrate.