Patents by Inventor Ying Su Yu

Ying Su Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10643965
    Abstract: A method of manufacturing a semiconductor device structure includes forming a bond or joint between a first device and a second device. The first device comprises an integrated passive device (IPD) and a first contact pad disposed over the IPD. The second device comprises a second contact pad. The first contact pad has a first surface with first lateral extents. The second contact pad has a second surface with second lateral extents. The width of the second lateral extents is less than the width of the first lateral extents. The joint structure includes the first contact pad, the second contact pad, and a solder layer interposed therebetween. The solder layer has tapered sidewalls extending in a direction away from the first surface of the first contact pad to the second surface of the second contact pad. At least one of the first surface or the second surface is substantially planar.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: May 5, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20200006179
    Abstract: A semiconductor device and method of reducing the risk of underbump metallization poisoning from the application of underfill material is provided. In an embodiment a spacer is located between a first underbump metallization and a second underbump metallization. When an underfill material is dispensed between the first underbump metallization and the second underbump metallization, the spacer prevents the underfill material from creeping towards the second underbump metallization. In another embodiment a passivation layer is used to inhibit the flow of underfill material as the underfill material is being dispensed.
    Type: Application
    Filed: September 13, 2019
    Publication date: January 2, 2020
    Inventors: Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20200006276
    Abstract: A method of manufacturing a semiconductor device structure includes forming a bond or joint between a first device and a second device. The first device comprises an integrated passive device (IPD) and a first contact pad disposed over the IPD. The second device comprises a second contact pad. The first contact pad has a first surface with first lateral extents. The second contact pad has a second surface with second lateral extents. The width of the second lateral extents is less than the width of the first lateral extents. The joint structure includes the first contact pad, the second contact pad, and a solder layer interposed therebetween. The solder layer has tapered sidewalls extending in a direction away from the first surface of the first contact pad to the second surface of the second contact pad. At least one of the first surface or the second surface is substantially planar.
    Type: Application
    Filed: September 13, 2019
    Publication date: January 2, 2020
    Inventors: Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu
  • Patent number: 10515865
    Abstract: A semiconductor device and method of reducing the risk of underbump metallization poisoning from the application of underfill material is provided. In an embodiment a spacer is located between a first underbump metallization and a second underbump metallization. When an underfill material is dispensed between the first underbump metallization and the second underbump metallization, the spacer prevents the underfill material from creeping towards the second underbump metallization. In another embodiment a passivation layer is used to inhibit the flow of underfill material as the underfill material is being dispensed.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: December 24, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20190326259
    Abstract: A method includes attaching a first-level device die to a dummy die, encapsulating the first-level device die in a first encapsulating material, forming through-vias over and electrically coupled to the first-level device die, attaching a second-level device die over the first-level device die, and encapsulating the through-vias and the second-level device die in a second encapsulating material. Redistribution lines are formed over and electrically coupled to the through-vias and the second-level device die. The dummy die, the first-level device die, the first encapsulating material, the second-level device die, and the second encapsulating material form parts of a composite wafer.
    Type: Application
    Filed: July 1, 2019
    Publication date: October 24, 2019
    Inventors: Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang, Hsien-Wei Chen, Wei-Cheng Wu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh
  • Patent number: 10347606
    Abstract: A method includes attaching a first-level device die to a dummy die, encapsulating the first-level device die in a first encapsulating material, forming through-vias over and electrically coupled to the first-level device die, attaching a second-level device die over the first-level device die, and encapsulating the through-vias and the second-level device die in a second encapsulating material. Redistribution lines are formed over and electrically coupled to the through-vias and the second-level device die. The dummy die, the first-level device die, the first encapsulating material, the second-level device die, and the second encapsulating material form parts of a composite wafer.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: July 9, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang, Hsien-Wei Chen, Wei-Cheng Wu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh
  • Patent number: 8788017
    Abstract: A method of treating a cancerous region in a breast of a patient comprising (i) imaging the breast in a three-dimensional coordinate system, (ii) stereotactically determining the location of the cancerous region in the breast, (iii) optionally determining the volume of the entire cancerous region to be treated, and (iv) while maintaining the breast in a three-dimensional coordinate system that is identical to or corresponds with the three-dimensional coordinate system used in (i), noninvasively exposing the cancerous region of the breast of the patient to a cancer-treatment effective dose of radiation; and equipment for use in such a method.
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: July 22, 2014
    Assignees: University of Maryland, Baltimore, Xcision Medical Systems, LLC
    Inventors: Xinsheng Cedric Yu, Ying Su Yu, William Regine
  • Publication number: 20100094119
    Abstract: A method of treating a cancerous region in a breast of a patient comprising (i) imaging the breast in a three-dimensional coordinate system, (ii) stereotactically determining the location of the cancerous region in the breast, (iii) optionally determining the volume of the entire cancerous region to be treated, and (iv) while maintaining the breast in a three-dimensional coordinate system that is identical to or corresponds with the three-dimensional coordinate system used in (i), noninvasively exposing the cancerous region of the breast of the patient to a cancer-treatment effective dose of radiation; and equipment for use in such a method.
    Type: Application
    Filed: February 26, 2008
    Publication date: April 15, 2010
    Inventors: Xinsheng Cedric Yu, Ying Su Yu, William Regine
  • Patent number: 7597104
    Abstract: A system and method for immobilization of the human breast in a prone position during imaging and radiotherapy. The system includes a vacuum-assisted breast immobilization cup comprising two layers joined together with an air space between. The inner layer has densely perforated holes while the outer layer is airtight. When a negative vacuum is applied to the intermediate airspace the breast tissue is sucked against the mesh wall of the inner layer to preventing sliding. In addition, the cup assembly is locked into a fixed position against the patient torso via a body fixture, as well as against the patient support structure. The established geometric relationship among the cup, chest wall, imaging/treatment table or couch may be accurately repeated. The system further includes a three-dimensional localization system to uniquely place the breast in a coordinate system having fixed geometric relationship with the breast immobilization cup.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: October 6, 2009
    Inventors: Mike Q. Zheng, Ying Su Yu
  • Publication number: 20080230074
    Abstract: A system and method for immobilization of the human breast in a prone position during imaging and radiotherapy. The system includes a vacuum-assisted breast immobilization cup comprising two layers joined together with an air space between. The inner layer has densely perforated holes while the outer layer is airtight. When a negative vacuum is applied to the intermediate airspace the breast tissue is sucked against the mesh wall of the inner layer to preventing sliding. In addition, the cup assembly is locked into a fixed position against the patient torso via a body fixture, as well as against the patient support structure. The established geometric relationship among the cup, chest wall, imaging/treatment table or couch may be accurately repeated. The system further includes a three-dimensional localization system to uniquely place the breast in a coordinate system having fixed geometric relationship with the breast immobilization cup.
    Type: Application
    Filed: March 23, 2007
    Publication date: September 25, 2008
    Inventors: Mike Q. Zheng, Ying Su Yu