Patents by Inventor Ying-Ta Tseng

Ying-Ta Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11337324
    Abstract: A manufacturing method of a housing includes the following steps: an object providing step, a shaping step, a cooling step, a tempering step and a stamping step. In the object providing step, a semi-finished object is provided. In the shaping step, the semi-finished object is heat shaped to form a plate. In the cooling step, the plate after heat shaping is cooled. In the tempering step, the plate after cooling is tempered at a low-temperature. In the stamping step, the plate after tempering at the low-temperature is stamped at a normal temperature to form a housing.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: May 17, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Shih-Wei Chiou, Yang-Po Chiu, Ying-Ta Tseng
  • Publication number: 20210079550
    Abstract: A surface treatment method for a metal housing includes: providing a metal housing made of an oxidizable alloy; performing a surface treatment on the metal housing, to obtain a semi-finished housing, the surface treatment comprises at least one selected from the group consisting of a micro-arc oxidation treatment, a surface painting treatment, a surface cutting treatment, a surface drawing treatment, and a surface defect treatment, the semi-finished housing comprising a substrate-exposed region; and performing a filming treatment on the semi-finished housing, to passivate the substrate-exposed region.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 18, 2021
    Inventors: Ying-Ta TSENG, Shih-Wei CHIOU
  • Publication number: 20200375050
    Abstract: A manufacturing method of a housing includes the following steps: an object providing step, a shaping step, a cooling step, a tempering step and a stamping step. In the object providing step, a semi-finished object is provided. In the shaping step, the semi-finished object is heat shaped to form a plate. In the cooling step, the plate after heat shaping is cooled. In the tempering step, the plate after cooling is tempered at a low-temperature. In the stamping step, the plate after tempering at the low-temperature is stamped at a normal temperature to form a housing.
    Type: Application
    Filed: May 6, 2020
    Publication date: November 26, 2020
    Inventors: Shih-Wei Chiou, Yang-Po Chiu, Ying-Ta Tseng