Abstract: A dynamic rotary traveling wave oscillator circuit includes plurality of multi-output spot-advancing blocks (MOSABs) forming a main-loop and a plurality of multi-input spot-advancing blocks (MISABs) forming a sub-loop. Depending on a desired division ratio, a connection connects blocks on the MOSABs and MISABs to create the desired division ratio.

Abstract: A dynamic rotary traveling wave oscillator circuit includes plurality of multi-output spot-advancing blocks (MOSABs) forming a main-loop and a plurality of multi-input spot-advancing blocks (MISABs) forming a sub-loop. Depending on a desired division ratio, a connection connects blocks on the MOSABs and MISABs to create the desired division ratio.

Abstract: A dynamic rotary traveling wave oscillator circuit includes plurality of multi-output spot-advancing blocks (MOSABs) forming a main-loop and a plurality of multi-input spot-advancing blocks (MISABs) forming a sub-loop. Depending on a desired division ratio, a connection connects blocks on the MOSABs and MISABs to create the desired division ratio.

Abstract: A method for dynamic provisioning of server deployments using a dormant mode for content servers. Client devices may conduct transactions with servers when the servers are in an active mode. However, in the dormant mode, the servers do not accept new transactions. Thus, by utilizing the dormant mode on one or more servers, a server deployment scheme can be effectively scaled down by reducing the number of active servers. In order to scale up the deployment, one or more active servers are added to the deployment.

Abstract: A dynamic rotary traveling wave oscillator circuit includes plurality of multi-output spot-advancing blocks (MOSABs) forming a main-loop and a plurality of multi-input spot-advancing blocks (MISABs) forming a sub-loop. Depending on a desired division ratio, a connection connects blocks on the MOSABs and MISABs to create the desired division ratio.

Abstract: A system for virtual capital operation over a network such as the internet includes a platform for a transaction between a first user and a second user of the system, a data processor for processing the flow of virtual currency occurred at the transaction between the first user and second user, and a trust company to allow real currency to be stored therein or withdrew therefrom in response to the flow of real currency occurred at the transaction, wherein the data processor generates an amount of virtual currency in response to an amount of real currency entrusted to the trust company.

Abstract: A system for virtual capital operation over a network such as the internet includes a platform for a transaction between a first user and a second user of the system, a data processor for processing the flow of virtual currency occurred at the transaction between the first user and second user, and a trust company to allow real currency to be stored therein or withdrew therefrom in response to the flow of real currency occurred at the transaction, wherein the data processor generates an amount of virtual currency in response to an amount of real currency entrusted to the trust company.

Abstract: The present invention discloses a base for transforming an inductor consisting of a core and a coil having two terminals into a surface mounted device. The present invention includes an insulating element, a substantially Z-shaped first conductive element and a substantially Z-shaped second conductive element. The first conductive element and the second conductive element further include a strip of first stem and a strip of second stem, respectively. The insulating element partially exposes lower surfaces of the first and second conductive elements and the first and second stems. The remaining portions of the first and second conductive elements are embedded in the insulating element. A terminal of the first conductive element extends toward the second conductive element and crosses a virtual cross-sectional line. Each of the terminals of the coil is wound around the respective recessed edge of the stems.

Abstract: A support is used to modify an inductive device to a surface mounting device. The inductive device is provided with a core and a coil, and the support includes an electric portion and an isolation portion. The electric portion, having a first surface and a second surface opposite to the first surface, is electrically coupled to the coil. The first surface of the electric portion is in contact with the core. The isolation portion is disposed on the second surface of the electric portion in a manner such that the isolation portion covers one part of the second surface of the electric portion. The isolation portion is flush with the other part of the second surface of the electric portion.

Abstract: A high-strength and high-conductivity copper alloy is disclosed which contains essentially of: (a) from 0.5 to 2.5 wt % of Ni; (b) from 0.5 to 2.5 wt % of Co; (c) from 0.5 to 0.8 wt % of Si; (d). from 0.05 to 0.15 wt % of either Mg or P or both; and (e) the balance of Cu. The amounts of Co, Ni, and Si satisfy the following equations: 2%≦(Ni+Co)≦4%, and 0.8≦(Ni/4+Co/6)/Si≦1.2. The new copper alloy exhibits substantially improved electrical conductivity, greater than 65% IACA, than the commercially available C7025 copper alloy, while maintaining a satisfactory tensile strength (greater than 600 MPa), and, thus, can be most advantageously used for preparing leadframes for use in high pin-number (greater than 100 pins) IC application.

Abstract: A high-strength and high-conductivity copper alloy is disclosed which contains essentially of: (a) from 0.5 to 2.5 wt % of Ni; (b) from 0.5 to 2.5 wt % of Co; (c) from 0.5 to 0.8 wt % of Si; (d) from 0.05 to 0.15 wt % of either Mg or P or both; and (e) the balance of Cu. The amounts of Co, Ni, and Si satisfy the following equations: 2%≦(Ni+Co)≦4%, and 0.8≦(Ni/4+Co/6)/Si≦1.2. The new copper alloy exhibits substantially improved electrical conductivity, greater than 65% IACA, than the commercially available C7025 copper alloy, while maintaining a satisfactory tensile strength (greater than 600 MPa), and, thus, can be most advantageously used for preparing leadframes for use in high pin-number (greater than 100 pins) IC application.

Abstract: A support is used to modify an inductive device to a surface mounting device. The inductive device is provided with a core and a coil, and the support includes an electric portion and an isolation portion. The electric portion, having a first surface and a second surface opposite to the first surface, is electrically coupled to the coil. The first surface of the electric portion is in contact with the core. The isolation portion is disposed on the second surface of the electric portion in a manner such that the isolation portion covers one part of the second surface of the electric portion. The isolation portion is flush with the other part of the second surface of the electric portion.

Abstract: The present invention discloses a base for transforming an inductor consisting of a core and a coil having two terminals into a surface mounted device. The present invention includes an insulating element, a substantially Z-shaped first conductive element and a substantially Z-shaped second conductive element. The first conductive element and the second conductive element further include a strip of first stem and a strip of second stem, respectively. The insulating element partially exposes lower surfaces of the first and second conductive elements and the first and second stems. The remaining portions of the first and second conductive elements are embedded in the insulating element. A terminal of the first conductive element extends toward the second conductive element and crosses a virtual cross-sectional line. Each of the terminals of the coil is wound around the respective recessed edge of the stems.

Abstract: A high-strength and high-conductivity copper alloy is disclosed which contains essentially of: (a) from 0.5 to 2.5 wt % of Ni; (b) from 0.5 to 2.5 wt % of Co; (c) from 0.5 to 0.8 wt % of Si; (d) from 0.05 to 0.15 wt % of either Mg or P or both; and (e) the balance of Cu. The amounts of Co, Ni, and Si satisfy the following equations: 2%<(Ni+Co)<4%, and 0.8<(Ni/4+Co/6)/Si<1.2. The new copper alloy exhibits substantially improved electrical conductivity, greater than 65% IACA, than the commercially available C7025 copper alloy, while maintaining a satisfactory tensile strength (greater than 600 MPa), and, thus, can be most advantageously used for preparing leadframes for use in high pin-number (greater than 100 pins) IC application.