Patents by Inventor Ying-Ti Chu

Ying-Ti Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7575778
    Abstract: The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.
    Type: Grant
    Filed: August 7, 2004
    Date of Patent: August 18, 2009
    Assignee: Embed Technology Co., Ltd.
    Inventors: Te-Yeu Su, Hsin-Herng Wang, Ying-Ti Chu, Chin-Ming Chu, Li-Chung Ping
  • Publication number: 20050051360
    Abstract: The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10 to 85 to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.
    Type: Application
    Filed: August 7, 2004
    Publication date: March 10, 2005
    Inventors: Te-Yeu Su, Hsin-Herng Wang, Ying-Ti Chu, Chin-Ming Chu, Li-Chung Ping