Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.

Abstract: A laser processing system includes a laser source, an optical splitting unit, a frequency conversion unit and at least one optical mixer. The optical splitting unit is provided to divide light emitted by the laser source into a first light and a second light, and the first light and the second light have the same wavelength range. The frequency conversion unit is provided to convert the second light into a working light. The working light includes a frequency converted light, and the frequency converted light and the second light have different wavelength ranges. The optical mixer is provided to mix the first light with the frequency converted light.

Abstract: An immersion cooling system includes a receiving member, a heat dissipation channel, and a heat sink. The receiving member is filled with coolant. The receiving member is connected to an end of the heat sink, and heat-generating entities such as one or more servers are positioned in a cavity of the receiving member. The heat dissipation channel is connected to the cavity and is connected to the heat sink. The heat dissipation channel communicates with the cavity and allows circulation of the coolant in the channel, the heat sink cooling down the coolant flowing into heat dissipation channel from the cavity. The immersion cooling system is compact, occupies very little space, and is easily installed, maintained, and moved. A server system having the immersion cooling system is also disclosed.

Abstract: An immersion cooling system includes a receiving member, a heat dissipation channel, and a heat sink. The receiving member is filled with coolant. The receiving member is connected to an end of the heat sink, and heat-generating entities such as one or more servers are positioned in a cavity of the receiving member. The heat dissipation channel is connected to the cavity and is connected to the heat sink. The heat dissipation channel communicates with the cavity and allows circulation of the coolant in the channel, the heat sink cooling down the coolant flowing into heat dissipation channel from the cavity. The immersion cooling system is compact, occupies very little space, and is easily installed, maintained, and moved. A server system having the immersion cooling system is also disclosed.

Abstract: A laser processing system includes a laser source, an optical splitting unit, a frequency conversion unit and at least one optical mixer. The optical splitting unit is provided to divide light emitted by the laser source into a first light and a second light, and the first light and the second light have the same wavelength range. The frequency conversion unit is provided to convert the second light into a working light. The working light includes a frequency converted light, and the frequency converted light and the second light have different wavelength ranges. The optical mixer is provided to mix the first light with the frequency converted light.

Abstract: Disclosed is a laser system and a laser flare machining method. The laser system includes a laser light source, a splitter element, and a scanning lens assembly. The laser light source projects a first light beam. The splitter element is furnished on a first path along which the first light beam travels, and splits the first light beam into a second light beam traveling along a second path and a third light beam traveling along a third path. The scanning lens assembly is furnished on the second path and the third path, and focus the second light beam and the third light beam at a machining position to process a work piece.

Abstract: An injection device includes a housing, a plunger, and a heating unit. The plunger is slidably arranged within the housing thereby performing a plunging movement therein. The heating unit is disposed within the housing for generating a heat energy inside the housing such that a filling material inside the housing can be soften and be transformed into a movable filling material with viscosity by absorbing the heat energy from the heating unit.

Abstract: A semiconductor element and a manufacturing method of the same are provided. The semiconductor element includes a substrate, a plurality of doping strips, a memory material layer, a plurality of conductive damascene structures, and a dielectric structure. The doping strips are formed in the substrate. The memory material layer is formed on the substrate, and the memory material layer comprises a memory area located on two sides of the doping strips. The conductive damascene structures are formed on the memory material layer. The dielectric structure is formed on the doping strips and between the conductive damascene structures. The conductive damascene structures are extended in a direction perpendicular to a direction which the doping strips are extended in.

Abstract: A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.

Abstract: A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.

Abstract: A capacitor includes a first patterned conductive layer, a second patterned conductive layer and a first patterned dielectric layer. The first patterned conductive layer resembles a comb with internal teeth, and the second patterned conductive layer resembles a comb with external teeth, the internal and the external teeth being interlaced in one plane. A thin first patterned dielectric layer within the same plane is shaped and arranged to infill all the gaps between the teeth. The first patterned conductive layer, the second patterned conductive layer, and the first patterned dielectric layer create a single coplanar layer, and a number of such interconnected coplanar layers are stacked within and contained by a multilayer circuit board.

Abstract: A method of manufacturing a metal silicide is disclosed below. A substrate having a first region and a second region is provided. A silicon layer is formed on the substrate. A planarization process is performed to make the silicon layer having a planar surface. A part of the silicon layer is removed to form a plurality of first gates on the first region and to form a plurality of second gates on the second region. The height of the first gates is greater than the height of the second gates, and top surfaces of the first gates and the second gates have the same height level. A dielectric layer covering the first gates and the second gates is formed and exposes the top surfaces of the first gates and the second gates. A metal silicide is formed on the top surfaces of the first gates and the second gates.

Abstract: A capacitor includes at least two electrode layers opposite to each other and a dielectric layer positioned between the at least two electrode layers. The at least two electrode layers have opposite polarities. Each electrode layer includes a positive electrode and a negative electrode. The positive electrode includes a plurality of first coupling portions spaced substantially evenly and arranged in parallel. The negative electrode includes a plurality of second coupling portions spaced substantially evenly and arranged in parallel. The positive electrode and the negative electrode of each electrode layer are coplanar, and the plurality of first coupling portions interlace with the plurality of second coupling portions.

Abstract: An plug storage structure of a cleaning robot is presented. A charging structure includes a charging base and a main body of an electronic device. The charging base includes a charging terminal and a projecting portion. The main body has an external housing, charging plugs and an plug storage device. When the main body reaches the charging base, the projecting portion triggers the plug storage device, so that the charging plugs protrude from the external housing, so as to be connected to the charging terminal. When the main body leaves the charging base, the plug storage device automatically receives the charging plugs inside the external housing, so as to keep the plugs of the cleaning robot received inside the external housing during cleaning, thereby preventing the plugs of the cleaning robot from colliding with and damaging adjacent furniture.

Abstract: A system and a method for ESD testing are contained in an ESD testing system which is running on an electronic device. A storage unit of the electronic device pre-stores a layout file which includes a layout pattern having electrical traces, an ESD entry point, and mounted positions of multiple electronic elements. The ESD testing method obtains the layout file from the storage unit; displays the layout pattern on a display unit of the electronic device, simulates ESD in the ESD entry point of the displayed layout pattern, tests electrical characteristics of the electrical traces between the ESD entry point and the mounted positions of multiple electronic elements to determine whether the electrical characteristics of the electrical traces pass or fail the ESD test, and marks the electrical traces which fail the ESD test on the displayed layout pattern.

Abstract: A semiconductor element and a manufacturing method of the same are provided. The semiconductor element includes a substrate, a plurality of doping strips, a memory material layer, a plurality of conductive damascene structures, and a dielectric structure. The doping strips are formed in the substrate. The memory material layer is formed on the substrate, and the memory material layer comprises a memory area located on two sides of the doping strips. The conductive damascene structures are formed on the memory material layer. The dielectric structure is formed on the doping strips and between the conductive damascene structures. The conductive damascene structures are extended in a direction perpendicular to a direction which the doping strips are extended in.

Abstract: A semiconductor device including a substrate, a plurality of stacked gate structures, a plurality of doped regions, a plurality of liner layers, a plurality of conductive layers, a plurality of dielectric layers and a plurality of word lines is provided. The substrate has a plurality of trenches therein. The stacked gate structures are on the substrate between the trenches. The doped regions are in the substrate at sidewalls or bottoms of the trenches. The liner layers are on at least a portion of sidewalls of the stacked gate structures and on sidewalls of the trenches. The conductive layers are in the trenches and electrically connected to the doped regions. The dielectric layers are on the conductive layers and between the stacked gate structures. The word lines are on the substrate and electrically connected to the stacked gate structures.

Abstract: In a computing device, a computerized method and a non-transitory storage medium are applied in checking whether the transmission lines in a stored wiring diagram meet a certain criterion in relation to vias in the routes of differential pairs. A transmission line is selected to determine whether or not the line belongs to a differential pair and passes through at least one via. Another transmission line of the differential pair is obtained for analysis when the selected transmission line passes through at least one via. Sizes of vias in the respective routes of the differential pair are compared and a distance between the vias of the differential pair is compared. The differential pair, and the sizes of vias which comply or do not comply with the criterion are recorded and displayed in a list of results.

Abstract: An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, and at least two resistors. When a signal transmitted by the circuit board is received by the input pins, a first portion of the signal is directly output from the output pins, a second portion of the signal is reflected by the first resistor and transmitted back to the output pins to output, and a third portion of the signal is reflected by the second resistor and transmitted back to the output pins to output, such that output of the equalizer applies two stages of compensation.

Abstract: An injection device includes a housing, a plunger, and a heating unit. The plunger is slidably arranged within the housing thereby performing a plunging movement therein. The heating unit is disposed within the housing for generating a heat energy inside the housing such that a filling material inside the housing can be soften and be transformed into a movable filling material with viscosity by absorbing the heat energy from the heating unit.