Abstract: An auction server and a selling method are provided. The auction server creates an auction with a bidding period for bidding a limited service during a non-repeatable period, time, and date. Further, after receiving a plurality of bid requests which include buyer IDs and bid prices thereof for the auction from a network, the auction server is able to determine at least one winning buyer ID from the buyer IDs according to a quantity of the limited service and the bid prices of the buyer IDs when the bidding period is expired. Accordingly, the auction server generates an auction result that indicates the at least one winning buyer ID and the bid price thereof.

Abstract: A system and method for managing parking spaces perform the following steps. Receive a login message corresponding to a first vehicle, a reservation message, and an insurance message from a client end. The reservation message indicates a reserved parking space among the parking spaces, and the insurance message indicates an insurance period and an insurance coverage. Determine whether the first vehicle parking in the reserved parking space matches the insurance coverage when the insurance period is expired. Make an insurance expiration record corresponding to the insurance message when the first vehicle parking in the reserved parking space matches the insurance coverage.

Abstract: A die bonding method and a die bonding structure of a light emitting diode package are provided. The die bonding structure includes a light transmissive adhesive layer formed on a surface of a base plate of a light emitting diode chip, a first metal layer formed on the adhesive layer, a second metal layer formed on a packaging base plate and multiple metallic compound layers. The metallic compound layers are formed by spreading a third metal layer disposed on at least one of the first metal layer and the second metal layer into the first metal layer and the second metal layer after the third metal layer is heated up. The melting points of the first metal layer and the second metal layer are higher than the melting point of the third metal layer.