Abstract: Method of fabricating package substrates includes providing a substrate including a capacitance layer sandwiched between first patterned circuits and second patterned circuit, in which a gap is formed between adjacent two of the first patterned circuits, and exposed a first region of the capacitance layer, and the second patterned circuit is overlapped with the first region; removing a part of the capacitance layer within the first region, to form an opening communicated with the gap; forming a dielectric layer from a side of the capacitance layer disposed with the first patterned circuits to fill up the gap and the opening; and removing a part of the dielectric layer within the gap and the opening to form a through hole to expose a part of the second patterned circuit, the remaining part of the first dielectric layer covers the capacitance layer and the first patterned circuits.

Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.

Abstract: A packaging substrate and a fabrication method thereof are disclosed. The packaging substrate includes: a substrate body having a plurality of first and second conductive pads formed on a surface thereof; a first insulating layer formed on the surface of the substrate body and having a plurality of first and second openings for respectively exposing the first and second conductive pads; a conductive layer formed on the first and second conductive pads and the first insulating layer around peripheries of the first and second conductive pads; a plurality of first and second conductive bumps formed on the conductive layer on the first and second conductive pads, respectively; a solder layer formed on the second conductive bumps; and a plurality of conductive posts formed on the first conductive bumps and having a width different from that of the first conductive bumps. The invention improves the fabrication efficiency.

Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.

Abstract: A circuit board surface structure and a fabrication method thereof are proposed. The circuit board surface structure includes: a circuit board having a plurality of electrically connecting pads formed on at least one surface thereof; a first and a second insulating protective layers formed on the surface of the circuit board in sequence; first and a second openings respectively formed in the first and second insulating protective layers to expose the electrically connecting pads on the surface of the circuit board, wherein the first and second openings have narrow top and wide bottom and the diameter of the first openings is bigger than that of the second openings; and conductive elements formed in the first and second openings on surfaces of the electrically connecting pads. The present structure facilitates to strengthen the bonding between the conductive elements and the corresponding electrically connecting pads.

Abstract: A packaging substrate is proposed, which includes: a circuit layer formed on a substrate and having conductive pads, an insulating protective layer formed on the substrate for covering the circuit layer and having openings for correspondingly exposing the conductive pads; copper bumps each having a connection portion formed in a corresponding one of the openings and electrically connected to a corresponding one of the conductive pads, and a protruding portion integrally connected to the connection portion and extending to a portion of the insulating protective layer surrounding the corresponding one of the openings, allowing the protruding portion to be greater in diameter than the connection portion, and a surface treatment layer having an electroplated nickel material formed on top surfaces of the protruding portions of the copper bumps, and an electroplated gold material formed on the electroplated nickel material.

Abstract: A circuit board surface structure and a fabrication method thereof are proposed. The circuit board surface structure includes: a circuit board having a plurality of electrically connecting pads formed on at least one surface thereof; a first and a second insulating protective layers formed on the surface of the circuit board in sequence; first and a second openings respectively formed in the first and second insulating protective layers to expose the electrically connecting pads on the surface of the circuit board, wherein the first and second openings have narrow top and wide bottom and the diameter of the first openings is bigger than that of the second openings; and conductive elements formed in the first and second openings on surfaces of the electrically connecting pads. The present structure facilitates to strengthen the bonding between the conductive elements and the corresponding electrically connecting pads.

Abstract: Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first and second conductive layers on the circuit board; forming first and second resist layers respectively on the first and second conductive layers, the resist layers having a plurality of openings for exposing the conductive layers on the pads; forming a metal layer in the openings of the first and second resist layers; and forming a first connecting layer on the metal layer; forming third and fourth resist layers on the first and second resist layers respectively, the third resist layer having a plurality of openings for exposing the first connecting layer on the metal layer on the second electrically.

Abstract: A circuit board surface structure and a fabrication method thereof are proposed. The circuit board surface structure includes: a circuit board having a plurality of electrically connecting pads formed on at least one surface thereof; a first and a second insulating protective layers formed on the surface of the circuit board in sequence; first and a second openings respectively formed in the first and second insulating protective layers to expose the electrically connecting pads on the surface of the circuit board, wherein the first and second openings have narrow top and wide bottom and the diameter of the first openings is bigger than that of the second openings; and conductive elements formed in the first and second openings on surfaces of the electrically connecting pads. The present structure facilitates to strengthen the bonding between the conductive elements and the corresponding electrically connecting pads.

Abstract: A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second surfaces of a circuit board; forming a conductive layer on the first insulating protective layer and the openings; forming first and second resist layers on the conductive layer and the second insulating protective layer respectively; forming first electrically connecting structures by electroplating on the exposed conductive layer over a plurality of first and second electrically connecting pads in openings of the first resist layer; removing the first and the second resist layers and the conductive layer covered by the first resist layer; and forming second electrically connecting structures by stencil printing on the conductive layer over the second electrically connecting pads on the first surface and on a plurality of third electrically connecting pads of the second surface of the circuit board.

Abstract: A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure having a plurality of conductive pads is formed on each of the first surface and the second surface, and conductive structures are formed in the circuit board for electrically connecting the circuit structures. Also, an insulating layer having a plurality of openings penetrating therethrough is formed on the circuit board for exposing the conductive pad. Then, a conductive layer is formed on a surface of the insulating layer having the opening formed on the first surface of the circuit board. An electroplating process is performed via the conductive layer and the conductive structure, such that a conductive bump is formed on the conductive pad located on the second surface of the circuit board.

Abstract: A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plurality of openings is formed penetrating through an insulating layer provided on the circuit board to expose the pad. Subsequently, a conductive base is attached to one surface of the circuit board for electrically connecting the pad. By such arrangement, a conductive material can be formed on the pad located on the other surface of the circuit board by an electroplating process via the conductive base, the pad on the surface, and the conductive structure within the circuit board.

Abstract: A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second surfaces of a circuit board; forming a conductive layer on the first insulating protective layer and the openings; forming first and second resist layers on the conductive layer and the second insulating protective layer respectively; forming first electrically connecting structures by electroplating on the exposed conductive layer over a plurality of first and second electrically connecting pads in openings of the first resist layer; removing the first and the second resist layers and the conductive layer covered by the first resist layer; and forming second electrically connecting structures by stencil printing on the conductive layer over the second electrically connecting pads on the first surface and on a plurality of third electrically connecting pads of the second surface of the circuit board.

Abstract: Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed.

Abstract: A method for fabricating electrical connections of a circuit board is provided. The circuit board has a plurality of electrical connection pads thereon. A protective layer is applied on the circuit board and has a plurality of openings for exposing the electrical connection pads. A conductive layer is formed on the protective layer and the electrical connection pads. A resist layer is applied on the conductive layer and has a set of openings for exposing a portion of the conductive layer covering some of the electrical connection pads. A first metal layer is electroplated in the openings of the resist layer. Another set of openings are formed through the resist layer corresponding to the rest of the electrical connection pads. A second metal layer is electroplated on the first metal layer and above the rest of the electrical connection pads to form different electrical connections on the circuit board.

Abstract: A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.

Abstract: A solder ball pad surface finish structure of a circuit board and a method for fabricating the same are proposed. An insulative protecting layer with a plurality of openings is formed on a circuit board to expose solder ball pads on the circuit board. A conductive layer is formed on the insulative protecting layer and in the openings, and a resist layer is also formed thereon. A plurality of openings are formed and defined in the resist layer corresponding to the solder ball pads. The area of openings of resist layer can be larger or smaller than the area of the openings of insulative protecting layer, and the resist layer is hung above the solder ball pads. A metal layer is formed on the conductive layer and in the openings of resist layer by electroplating and an adhesive layer is formed successively. Then, the resist layer and the conductive layer underneath the resist layer are removed. Afterwards, the adhesive layer is further processed by re-flow process.

Abstract: A processing apparatus for electroplating conductive bumps on an organic circuit board includes a surface cleaning unit for removing organic contaminant on the surface of conductive layer on the circuit board, a rinsing unit for rinsing the surface of conductive layer, a surface activating unit for removing a metal oxide on the surface of conductive layer, and an electroplating unit for electroplating a conductive bump on the exposing surface of the conductive layer. Thus, the conductive bumps are formed on the circuit board by electroplating.

Abstract: A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.

Abstract: A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure having a plurality of conductive pads is formed on each of the first surface and the second surface, and conductive structures are formed in the circuit board for electrically connecting the circuit structures. Also, an insulating layer having a plurality of openings penetrating therethrough is formed on the circuit board for exposing the conductive pad. Then, a conductive layer is formed on a surface of the insulating layer having the opening formed on the first surface of the circuit board. An electroplating process is performed via the conductive layer and the conductive structure, such that a conductive bump is formed on the conductive pad located on the second surface of the circuit board.