Patents by Inventor Ying-Tz Hung

Ying-Tz Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for de-bonding carriers
    Patent number: 8629043
    Abstract: A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: January 14, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung Yu Wang, Jui-Pin Hung, Chih-Hao Chen, Chun-Hsing Su, Yi-Chao Mao, Kung-Chen Yeh, Yi-Lin Tsai, Ying-Tz Hung, Chin-Fu Kao, Shih-Yi Syu, Chin-Chuan Chang, Hsien-Wen Liu, Long Hua Lee
  • Methods for De-Bonding Carriers
    Publication number: 20130122689
    Abstract: A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.
    Type: Application
    Filed: November 16, 2011
    Publication date: May 16, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung Yu Wang, Jui-Pin Hung, Chih-Hao Chen, Chun-Hsing Su, Yi-Chao Mao, Kung-Chen Yeh, Yi-Lin Tsai, Ying-Tz Hung, Chin-Fu Kao, Shih-Yi Syu, Chin-Chuan Chang, Hsien-Wen Liu, Long Hua Lee