Patents by Inventor Ying Wai Sun

Ying Wai Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTICAL PACKAGING STRUCTURE FOR LIDAR
    Publication number: 20250102633
    Abstract: The present invention relates to the field of LIDAR technology, and in particular to an optical package structure for a LIDAR. An optical package structure for a LIDAR includes a housing; a laser transceiver component arranged in the housing, and configured to emit a laser and to receive for detection; a temperature control component arranged in the housing and connected to the laser transceiver component; and a conduction circuit board arranged on the housing and electrically connected to an external circuit board. The conduction circuit board is arranged to be electrically connected to the laser transceiver component.
    Type: Application
    Filed: August 8, 2024
    Publication date: March 27, 2025
    Inventors: Chong Yang QIN, Xianwen Feng, Vincent Wei Hong, Vivian Wei Ma, Ying Wai Sun
  • Compact micro bench for optical transceiver sub-assembly
    Patent number: 12169313
    Abstract: An optical transceiver sub-assembly (100) integrated with a silicon photonic platform having a folded optical path for transmitting and detecting a plurality of optical signals includes a housing chamber (105) and a top cover (110) to enclose elements of the optical transceiver sub-assembly (100) other than the housing chamber (105) and the top cover (110), a bottom housing module (115) accommodating an optical micro integration (130). In particular, the optical transceiver sub-assembly (100) is operably configured to establish an optical-electrical communication with an outside surrounding.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: December 17, 2024
    Assignee: Cloud Light Technology Limited
    Inventors: Wing Keung Mark Mak, Vincent Wai Hung, Hulmut Ying Wai Sun, Vivian Wei Ma, Yvonne Xiaoming Yu, Jason Hok Hay Tang, Kwong Shing Tsang, Hermit Ka Kit Wong
  • Compact Micro Bench for Optical Transceiver Sub-Assembly
    Publication number: 20230236371
    Abstract: An optical transceiver sub-assembly (100) integrated with a silicon photonic platform having a folded optical path for transmitting and detecting a plurality of optical signals includes a housing chamber (105) and a top cover (110) to enclose elements of the optical transceiver sub-assembly (100) other than the housing chamber (105) and the top cover (110), a bottom housing module (115) accommodating an optical micro integration (130). In particular, the optical transceiver sub-assembly (100) is operably configured to establish an optical-electrical communication with an outside surrounding.
    Type: Application
    Filed: September 26, 2022
    Publication date: July 27, 2023
    Inventors: Wing Keung Mark Mak, Vincent Wai Hung, Hulmut Ying Wai Sun, Vivian Wei Ma, Yvonne Xiaoming Yu, Jason Hok Hay Tang, Kwong Shing Tsang, Hermit Ka Kit Wong