Patents by Inventor Ying-Won JEON

Ying-Won JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935696
    Abstract: A capacitor includes a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: March 19, 2024
    Assignee: NUINTEK CO LTD
    Inventors: Dae-Jin Park, Ying-Won Jeon, Jin-A Park, Hyeon-Jin Kim, Taek-Hyeon Lee
  • Patent number: 11929209
    Abstract: The present disclosure relates to a metal case capacitor that includes: a capacitor module (10) including a capacitor device, a first busbar (1) electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal (1a) on an exposed side, a second busbar (2) electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal (2a) on an exposed side, and an insulating sheet disposed between the first busbar (1) and the second busbar (2); a metallic external case (20) having a space; a plastic insulating member positioned between the capacitor module (10) and the metallic external case (20) and insulating the capacitor module (10) and the metallic external case (20) from each other; and a filler permeating in a gel or liquid state into a space between the capacitor module (10) and the metallic external case (20).
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: March 12, 2024
    Assignee: NUINTEK CO LTD
    Inventors: Dae-Jin Park, Ying-Won Jeon, Jin-A Park
  • Patent number: 11715601
    Abstract: The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: August 1, 2023
    Assignee: NUINTEK CO LTD
    Inventors: Dae-Jin Park, Ying-Won Jeon, Jin-A Park, Hyeon-Jin Kim, Taek-Hyeon Lee
  • Publication number: 20230053806
    Abstract: A capacitor comprises: a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.
    Type: Application
    Filed: June 29, 2021
    Publication date: February 23, 2023
    Inventors: Dae-Jin PARK, Ying-Won JEON, Jin-A PARK, Hyeon-Jin KIM, Taek-Hyeon LEE
  • Publication number: 20230059398
    Abstract: The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.
    Type: Application
    Filed: June 29, 2021
    Publication date: February 23, 2023
    Inventors: Dae-Jin PARK, Ying-Won JEON, Jin-A PARK, Hyeon-Jin KIM, Taek-Hyeon LEE
  • Publication number: 20230039264
    Abstract: The present disclosure relates to a metal case capacitor that includes: a capacitor module (10) including a capacitor device, a first busbar (1) electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal (1a) on an exposed side, a second busbar (2) electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal (2a) on an exposed side, and an insulating sheet disposed between the first busbar (1) and the second busbar (2); a metallic external case (20) having a space; a plastic insulating member positioned between the capacitor module (10) and the metallic external case (20) and insulating the capacitor module (10) and the metallic external case (20) from each other; and a filler permeating in a gel or liquid state into a space between the capacitor module (10) and the metallic external case (20).
    Type: Application
    Filed: June 29, 2021
    Publication date: February 9, 2023
    Inventors: Dae-Jin PARK, Ying-Won JEON, Jin-A PARK