Patents by Inventor Ying-Yang SU

Ying-Yang SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200266177
    Abstract: A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.
    Type: Application
    Filed: May 4, 2020
    Publication date: August 20, 2020
    Inventors: Min-Hsun HSIEH, Hsin-Mao LIU, Ying-Yang SU
  • Publication number: 20200259050
    Abstract: A micro light emitting device display apparatus including a circuit substrate, a plurality of micro light emitting devices, a first common electrode layer, and a second common electrode layer is provided. The micro light emitting devices are disposed on the circuit substrate and individually include an epitaxial structure and a first-type electrode and a second-type electrode respectively disposed on two side surfaces of the epitaxial structure opposite to each other. The first common electrode layer is disposed on the circuit substrate and directly covers the plurality of first-type electrodes of the micro light emitting devices. The second common electrode layer is disposed between the micro light emitting devices. The first common electrode layer is electrically connected to the second common electrode layer.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Chih-Ling Wu, Yen-Yeh Chen, Yi-Min Su, Yi-Chun Shih, Bo-Wei Wu, Yu-Yun Lo, Ying-Ting Lin, Tzu-Yang Lin
  • Publication number: 20200243737
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 30, 2020
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Publication number: 20200243478
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: August 27, 2019
    Publication date: July 30, 2020
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Publication number: 20200176508
    Abstract: A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, a plurality of micro semiconductor devices disposed on the substrate, and a first supporting layer disposed between the substrate and the micro semiconductor devices. Each of the micro semiconductor devices has a first electrode and a second electrode disposed on a lower surface of the micro semiconductor devices. The lower surface includes a region, wherein the region is between the first electrode and the second electrode. An orthographic projection of the first supporting layer on the substrate at least overlaps an orthographic projection of a portion of the region on the substrate. The first supporting layer directly contacts the region.
    Type: Application
    Filed: June 7, 2019
    Publication date: June 4, 2020
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Chih-Ling WU, Ying-Tsang LIU, Pei-Hsin CHEN, Yi-Chun SHIH, Yi-Ching CHEN, Yu-Chu LI, Huan-Pu CHANG, Yu-Yun LO, Yi-Min SU, Tzu-Yang LIN, Yu-Hung LAI
  • Patent number: 10643980
    Abstract: A light-emitting device includes a light-emitting element, a supporting structure, a first wavelength conversion structure, and a light-absorbing layer. The light-emitting element includes a plurality of active stacks separated from each other, a first-type semiconductor layer continuously arranged on the plurality of active stacks, and a plurality of second-type semiconductor layers under the plurality of active stacks. The supporting structure is disposed on the light-emitting element and includes a first opening. The first wavelength conversion structure disposed in the first opening. The light-absorbing layer disposed on the top surface of the supporting structure.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: May 5, 2020
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Hsin-Mao Liu, Ying-Yang Su
  • Publication number: 20200037401
    Abstract: A planar heating structure is disclosed. The planar heating structure includes a glass substrate layer, a nanometallic transparent conductive layer, and a first passivation layer. The nanometallic transparent conductive layer is disposed on the glass substrate layer and receives a voltage to generate heat energy. The first passivation layer is disposed on the nanometallic transparent conductive layer and completely covers the nanometallic transparent conductive layer.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 30, 2020
    Inventors: Ho-Hsun Chi, Ying-Che Chen, Yu Zhang, Hebo Yang, Fu-Yu Su, Chao Gao, Shu-Guang Zhu, Chun-Ya Tang, Wen-Da Chen
  • Publication number: 20190229098
    Abstract: A light-emitting device includes a light-emitting element, a supporting structure, a first wavelength conversion structure, and a light-absorbing layer. The light-emitting element includes a plurality of active stacks separated from each other, a first-type semiconductor layer continuously arranged on the plurality of active stacks, and a plurality of second-type semiconductor layers under the plurality of active stacks. The supporting structure is disposed on the light-emitting element and includes a first opening. The first wavelength conversion structure disposed in the first opening. The light-absorbing layer disposed on the top surface of the supporting structure.
    Type: Application
    Filed: January 22, 2019
    Publication date: July 25, 2019
    Inventors: Min-Hsun HSIEH, Hsin-Mao LIU, Ying-Yang SU