Abstract: A vibration module is installed in a touch plate. The vibration module includes a housing, a magnetic element, a coil layer and a base plate. The housing includes an accommodation space and an elastic structure. The magnetic element and the coil layer are aligned with each other and disposed within the accommodation space. The base plate is connected with the housing. In addition, the magnetic element and the coil layer are sealed in the accommodation space. The base plate is connected with the housing to seal the magnetic element and the coil layer in the accommodation space. The elastic structure is extended in the direction toward the accommodation space and connected with the magnetic element. The magnetic element is pushed to be close to the coil layer by the elastic structure. When the coil layer is electrically conducted, the magnetic element senses the coil layer and vibrates.

Abstract: A cathode for rare earth molten salt electrolysis is provided. The cathode includes a column. The bottom of the column includes a cone. The peak of the cone includes a sharp tip or a flat surface. When the peak of the cone is the sharp tip, an opening angle of the sharp tip is between 5 degree and 175 degree. An electrolysis system having a cathode is also provided.

Abstract: A flexible warning light includes a lamp housing including a base with a bottom plate, a flexible lamp shell covering base and an accommodation space defined between base and flexible lamp shell, and a light-emitting device mounted in the accommodation space and having at least one light-emitting element on the top of a flexible circuit board of a light-emitting device on the top, and a first heat sink and multiple second heat sinks on the bottom. The flexible lamp shell will elastically deform in accordance with the surface curvature of a preset vehicle body to drive first heat sink and second heat sinks to deform so that the base can be closely attached to the curved surface of the preset vehicle body through the deformation of the first heat sink and the second heat sinks, so as to achieve the effect of being more compliant with the curved vehicle body.

Abstract: A flexible warning light includes a lamp housing including a base with a bottom plate, a flexible lamp shell covering base and an accommodation space defined between base and flexible lamp shell, and a light-emitting device mounted in the accommodation space and having at least one light-emitting element on the top of a flexible circuit board of a light-emitting device on the top, and a first heat sink and multiple second heat sinks on the bottom. The flexible lamp shell will elastically deform in accordance with the surface curvature of a preset vehicle body to drive first heat sink and second heat sinks to deform so that the base can be closely attached to the curved surface of the preset vehicle body through the deformation of the first heat sink and the second heat sinks, so as to achieve the effect of being more compliant with the curved vehicle body.

Abstract: Some implementations described herein provide a laser device. The laser device includes a first portion of the laser device, at a proximal end of the laser device, that includes one or more optical devices, where the first portion is configured to emit first electromagnetic waves having a first wavelength. The laser device includes a second portion of the laser device, at a distal end of the laser device, that includes an optical crystal configured to receive the first electromagnetic waves and to emit second electromagnetic waves having a second wavelength based on reception of the first electromagnetic waves, where the optical crystal includes a thin film coating disposed on an end of the optical crystal, the thin film coating configured to: support emission of the second electromagnetic waves from the optical crystal, and support internal reflection of the first electromagnetic waves within the optical crystal.

Abstract: A bendable light device for a vehicle is provided and includes a bendable mounting plate and a light kit. The bendable mounting plate includes a main body portion. The light kit includes a first light assembly having a first light base, a first light cover and a first light emitting module between the first light base and the first light cover. A first assembling portion is formed on a side of the first light base and for assembling with the main body portion of the bendable mounting plate. The first light cover is mounted on the first light base. The bendable mounting plate is bent to be attached onto a surface of a vehicle body of the vehicle and fitted with a curve of the surface, such that the bendable light device can be easily attached onto the surface of the vehicle body of the vehicle without any gap therebetween.

Abstract: A semiconductor fabrication facility is provided. The semiconductor fabrication facility includes a processing tool and a transmission assembly. The transmission assembly is connected to the processing tool and comprises a number of transmission lines used to supply electric power or a fluid to the processing tool or remove the fluid or an exhaust gas from the processing tool. The transmission lines includes a first transmission line and a second transmission line. The first transmission line has a first temperature and the second transmission line has a second temperature. The second temperature is higher than the first temperature. The first transmission line and the second transmission line are arranged such that a thermal energy of the second transmission line is able to be transmitted to the first transmission line to change the first temperature of the first transmission line.

Abstract: Some implementations described herein provide a laser device. The laser device includes a first portion of the laser device, at a proximal end of the laser device, that includes one or more optical devices, where the first portion is configured to emit first electromagnetic waves having a first wavelength. The laser device includes a second portion of the laser device, at a distal end of the laser device, that includes an optical crystal configured to receive the first electromagnetic waves and to emit second electromagnetic waves having a second wavelength based on reception of the first electromagnetic waves, where the optical crystal includes a thin film coating disposed on an end of the optical crystal, the thin film coating configured to: support emission of the second electromagnetic waves from the optical crystal, and support internal reflection of the first electromagnetic waves within the optical crystal.

Abstract: The present disclosure provides a clock control circuit and method for a circuitry. The circuitry includes a scan flip-flop circuit, an at-speed domain and a timing exception domain. The scan flip-flop circuit is configured to output data to the at-speed domain and the timing exception domain. The clock control circuit includes a first gate control circuit, a first gate circuit, a second gate control circuit and a second gate circuit. The first gate circuit is controlled by a first control signal output by the first gate control circuit, a scan enable signal and a scan mode signal to block or output a clock signal to the scan flip-flop circuit. The second gate circuit is controlled by a second control signal output by the second gate control circuit to block or output an output signal of the scan flip-flop circuit to the timing exception domain.

Abstract: A test circuit coupled to a memory device and configured to read data stored in the memory device during a memory dump, includes a dump controller and a pattern generator. The dump controller triggers the pattern generator to start a pattern generating operation in response to a setting of memory dump mode by a processor. The pattern generator generates multiple control signals in the pattern generating operation and provides the control signals to the memory device. The control signals include an address signal, a memory enable signal and a read enable signal. The address signal includes multiple memory addresses arranged in multiple consecutive clock cycles of the processor. The consecutive clock cycles of the processor is provided to read the data stored in the memory addresses.

Abstract: A touch module includes a base plate, a first magnet, a second magnet, a touch pad, a first magnetic board and a second magnetic board. The first magnet and the second magnet are installed on the base plate and separated from each other. The touch pad is located over the base plate to cover the first magnet and the second magnet. The first magnetic board and the second magnetic board are separated from each other, located under the touch pad and coupled with the touch pad. The first magnetic board is aligned with the first magnet. The second magnetic board is aligned with the second magnet. The driving circuit is electrically coupled with the first magnetic board and the second magnetic board. The first magnetic board induces a magnetic field of the first magnet. The second magnetic board induces a magnetic field of the second magnet.

Abstract: A touch module includes a base plate, a first magnet, a second magnet, a touch pad, a first magnetic board and a second magnetic board. The first magnet and the second magnet are installed on the base plate and separated from each other. The touch pad is located over the base plate to cover the first magnet and the second magnet. The first magnetic board and the second magnetic board are separated from each other, located under the touch pad and coupled with the touch pad. The first magnetic board is aligned with the first magnet. The second magnetic board is aligned with the second magnet. The driving circuit is electrically coupled with the first magnetic board and the second magnetic board. The first magnetic board induces a magnetic field of the first magnet. The second magnetic board induces a magnetic field of the second magnet.

Abstract: A semiconductor fabrication facility is provided. The semiconductor fabrication facility includes a processing tool and a transmission assembly. The transmission assembly is connected to the processing tool and comprises a number of transmission lines used to supply electric power or a fluid to the processing tool or remove the fluid or an exhaust gas from the processing tool. The transmission lines includes a first transmission line and a second transmission line. The first transmission line has a first temperature and the second transmission line has a second temperature. The second temperature is higher than the first temperature. The first transmission line and the second transmission line are arranged such that a thermal energy of the second transmission line is able to be transmitted to the first transmission line to change the first temperature of the first transmission line.

Abstract: A scan clock gating controller and a method for performing a stuck-at fault test among multiple block circuits are provided. The scan clock gating controller includes a decoder and multiple clock gating circuits. The decoder is configured to generate multiple one-hot control signals according to a selection signal. The multiple clock gating circuits are configured to generate multiple final scan clocks to the multiple block circuits according to the multiple one-hot control signals, a scan enable signal and an initial scan clock. When the scan enable signal has a first logic value, the multiple clock gating circuits enable the multiple final scan clocks, respectively. When the scan enable signal has a second logic value, the multiple clock gating circuits control whether to enable the multiple final scan clocks according to the multiple one-hot control signals, respectively.

Abstract: A touchpad module for a computing device is provided. A fixing frame is concavely formed in a casing of the computing device. The fixing frame includes a supporting part. The touchpad module is installed within the fixing frame. The touchpad module includes a touch member and a pressure sensing element. The touch member includes a covering plate and a circuit board. An edge part of covering plate is supported on the supporting part. The pressure sensing element is installed on the touch member and electrically connected with the circuit board. While the touch member is pressed, the touch member is bent downwardly. Consequently, the touch member has a deformation amount. According to the deformation amount, a magnitude of a pressing force exerted on the touch member is sensed, and a pressure sensing signal is generated.

Abstract: A scan chain designing method includes: obtaining test points according to a gate-level netlist; determining integers M and N, wherein M and N are no greater than an amount X of the test points; selecting M and N test points to be a first and second set test points according to a priority; obtaining a first test coverage and a first test pattern count according to the first set test points and obtaining a second test coverage and a second test pattern count according to the second set test points; obtaining a predicted test coverage curve according to the first and second test coverages; determining an optimum amount O according to the predicted test coverage curve, the first and second test pattern counts, wherein O is no greater than X; and selecting O test points to arrange a scan chain according to the priority and the optimum amount O.

Abstract: A touchpad module for a computing device is provided. A fixing frame is concavely formed in a casing of the computing device. The fixing frame includes a supporting part. The touchpad module is installed within the fixing frame. The touchpad module includes a touch member and a pressure sensing element. The touch member includes a covering plate and a circuit board. An edge part of covering plate is supported on the supporting part. The pressure sensing element is installed on the touch member and electrically connected with the circuit board. While the touch member is pressed, the touch member is bent downwardly. Consequently, the touch member has a deformation amount. According to the deformation amount, a magnitude of a pressing force exerted on the touch member is sensed, and a pressure sensing signal is generated.

Abstract: The present application discloses a calibration data generation circuit and an associated method. The calibration data generation circuit includes: a first delay unit, having a first delay amount; and a first scan path, including: a first scan flip-flop, including: a scan data input terminal; a clock input terminal, arranged for receiving a clock signal; and an output terminal; and a second scan flip-flop, including: a scan data input terminal, coupled to the output terminal of the first scan flip-flop; a clock input terminal, arranged for receiving a delayed clock signal formed by the clock signal passing through the first delay unit; and an output terminal; wherein when the calibration data generation circuit operates, the first scan flip-flop and the second scan flip-flop are configured in a scan shift mode.

Abstract: A touch module includes a base plate, a magnet, a touchpad and a magnetic board. The magnetic board includes a first sensing line, a second sensing line, a third sensing line, a first communication part and a second communication part. The touchpad is located over the base plate. The magnetic board is arranged between the touchpad and the magnet. The first sensing line, the second sensing line and the third sensing line of the magnetic board are in parallel with each other and stacked on each other. The first sensing line is electrically connected with the second sensing line through the first communication part. The second sensing line is electrically connected with the third sensing line through the second communication part. The first sensing line, the second sensing line and the third sensing line sense a magnetic field of the magnet and generates a vibration.

Abstract: A voltage contrast defect analysis method including the following steps is provided. A voltage contrast defect detection is performed on a die to be tested by using an electron beam inspection machine to find out a defect address of a voltage contrast defect. A first scanning electron microscope image at the defect address of the die to be tested is obtained by using a scanning electron microscope. A first critical dimension of the first scanning electron microscope image at the defect address of the die to be tested is measured. The first critical dimension on the die to be tested is compared with a corresponding second critical dimension on a reference die where no voltage contrast defect occurs at the defect address to determine whether the first critical dimension and the second critical dimension are the same.