Patents by Inventor Ying-Yen Cheng

Ying-Yen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10074946
    Abstract: A receptacle connector adapted to be fixed to a casing of an electronic device and electrically connected to a circuit board for enabling the receptacle connector to be adapted to connect with a plug connector is provided. The receptacle connector includes an insulating body and a plurality of conductive terminals. The insulating body has a tunnel, and the tunnel extends from the outer side of the insulating body to the inner side of the insulating body, wherein a side of the tunnel is exposed at a top portion of the insulating body, and the insulating body is adapted to be fixed to the casing to cover the side of the tunnel, so that the tunnel is adapted to form a plug hole with the casing. The conductive terminals are disposed through the insulating body. A receptacle connector and an electronic device are also provided.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: September 11, 2018
    Assignee: HTC Corporation
    Inventors: Ying-Yen Cheng, Wan-Hsieh Liu, I-Cheng Chuang, Hsin-Chih Liu, Chih-Wei Tu, Cheng-Lung Chang, Chien-Ping Chen
  • Patent number: 9992895
    Abstract: An electronic apparatus including a housing, a motherboard, a battery and a display module is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery. The display module is disposed in the accommodating space and stacked over the battery. The battery is located between the motherboard and the display module. At least one edge of the battery in a width direction of the battery is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: June 5, 2018
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen
  • Patent number: 9965003
    Abstract: An electronic assembly including a circuit board, a heat-generating element, and a heat pipe is provided. The heat-generating element includes a bottom surface and a side surface connected to the bottom surface. The heat-generating element is mounted on the circuit board via the bottom surface. The heat pipe is thermally coupled to the side surface of the heat-generating element to absorb heat from the heat-generating element. Additionally, an electronic device includes a casing, a display, and the above-described electronic assembly. The display is mounted on the casing. The electronic assembly is disposed in the casing. The heat-generating element is mounted on the circuit board and its side surface is thermally coupled to the heat pipe. As a result, the limitation on the thickness of the heat pipe is relaxed, thereby allowing the efficiency of the heat pipe to be increased.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: May 8, 2018
    Assignee: HTC Corporation
    Inventors: Ying-Yen Cheng, Ya-Lin Hsiao
  • Patent number: 9728352
    Abstract: A switch structure and an electronic device using the same are provided. The electronic device has a casing, and the switch structure is disposed at an inner side of the key portion of the casing. The switch structure includes an elastic member, a force transmission member and a strain sensor. The elastic member is connected to the casing. The force transmission member is located inside the casing. The strain sensor is disposed on the elastic member, and the strain sensor and the force transmission member are disposed are two opposite sides of the elastic member respectively. The elastic member is configured to be deformed by the force transmission member when an external force is applied to an outside of the key portion.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: August 8, 2017
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu, Hung-Wen Lin
  • Patent number: 9660685
    Abstract: An electronic device and a key module are provided. The electronic device includes a case, a key plate, a switch, a location sensor and a processor. The case has a first hole. The key plate is slidably disposed at the inner wall of the case. Portion of the key plate is exposed at the first hole, and the key plate is configured to slide between a first location and a second location. The switch is disposed at the case. The key plate is suitable for pressing the switch to enable the switch to send a switch signal. The location sensor is disposed at the case for sensing whether the key plate is located at the first location or the second location. The processor is electrically coupled to the switch and the location sensor and performs a first command or a second command in response to the switch signal and according the sensing result of the location sensor.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: May 23, 2017
    Assignee: HTC Corporation
    Inventors: I-Hsuan Lin, Ying-Yen Cheng, Yu-Jing Liao
  • Publication number: 20170010642
    Abstract: An electronic assembly including a circuit board, a heat-generating element, and a heat pipe is provided. The heat-generating element includes a bottom surface and a side surface connected to the bottom surface. The heat-generating element is mounted on the circuit board via the bottom surface. The heat pipe is thermally coupled to the side surface of the heat-generating element to absorb heat from the heat-generating element. Additionally, an electronic device includes a casing, a display, and the above-described electronic assembly. The display is mounted on the casing. The electronic assembly is disposed in the casing. The heat-generating element is mounted on the circuit board and its side surface is thermally coupled to the heat pipe. As a result, the limitation on the thickness of the heat pipe is relaxed, thereby allowing the efficiency of the heat pipe to be increased.
    Type: Application
    Filed: July 9, 2015
    Publication date: January 12, 2017
    Inventors: Ying-Yen Cheng, Ya-Lin Hsiao
  • Patent number: 9538655
    Abstract: An electronic assembly includes an electronic module, a rigid board, a first flexible board, a second flexible board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connection end and a first pad arrangement at the first connection end. The first pad arrangement has a plurality of first pads. The second flexible board is connected to the rigid board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement has a plurality of second pads. The first pads are structurally and electrically connected to the second pads through the conductive adhesive layer.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: January 3, 2017
    Assignee: HTC Corporation
    Inventors: Hsin-Chih Liu, Ying-Yen Cheng, Yu-Jing Liao
  • Patent number: 9531853
    Abstract: An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the rear cover. The second electronic element is disposed between the first electronic element and the rear cover. The conductive tape is disposed between the first electronic element and the second electronic element, and contacts the first electronic element and the second electronic element to electrically connect the first electronic element to the second electronic element. The elastomer is disposed between the first electronic element and the second electronic element, and is attached to the conductive tape under pressure. An electronic module including the first electronic element, the second electronic element, the conductive tape, and the elastomer above is provided.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: December 27, 2016
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu
  • Patent number: 9531932
    Abstract: A camera module is provided. The camera module includes a camera device and a support ring. The camera device includes a substrate, an image sensor device on the substrate, and a holder for covering the image sensor device, wherein the holder includes a side portion placed around the image sensor device. The support ring is fixed to and laterally extends from the side portion of the holder, and is attached onto a wall portion of the chassis. A portable device with the camera module is also disclosed.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 27, 2016
    Assignee: HTC Corporation
    Inventors: Hsin-Chih Liu, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen, I-Cheng Chuang, Chia-Huan Chang
  • Patent number: 9502798
    Abstract: An electrical connector having a circuit board and elastic pieces is provided. The elastic pieces are disposed on the circuit board. Each elastic piece includes contact portions, fixing portions and insulating portions. The fixing portions are fixed on the circuit board and electrically connected to the circuit board. The contact portions are connected to corresponding fixing portions and are protruded from the fixing portions along a direction away from the circuit board. Each insulating portion is connected to two adjacent fixing portions, so as to connect and electrically insulate the fixing portions. Moreover, an electronic device including the above-mentioned connector is also provided.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: November 22, 2016
    Assignee: HTC Corporation
    Inventors: Hsin-Hao Lee, Ying-Yen Cheng, Chia-Lin Chang, Han-Ying Lei
  • Patent number: 9360894
    Abstract: A water-resistant electronic device includes a casing, a key body, a first circuit board and an elastomer. The casing has an opening and a recess communicating with the opening. The key body is disposed in the opening. The first circuit board has a switch. The elastomer envelops the first circuit board and is embedded with interference fit in the recess to achieve a water-resistant effect. The key body is pressed to trigger the switch. Besides, a water-resistant key module is suitable for the water-resistant electronic device and includes the key body, the first circuit board and the elastomer above.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: June 7, 2016
    Assignee: HTC Corporation
    Inventors: I-Hsuan Lin, Ying-Yen Cheng
  • Patent number: 9332329
    Abstract: An electronic apparatus includes the following elements. A housing has at least an opening and an accommodating space. A first circuit board is disposed in the accommodating space. A battery module disposed in the accommodating space is stacked over the first circuit board. A display module disposed in the accommodating space is stacked over the battery module. The display module is visible through the opening. A second circuit board is disposed in the accommodating space and beside the battery module. At least a part of the second circuit board is not disposed below the display module. A first speaker is disposed in the accommodating space and below the part of the second circuit board. The first speaker has a top side with a first sound hole aligned to a slot of the part of the second circuit board.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: May 3, 2016
    Assignee: HTC Corporation
    Inventors: Ying-Yen Cheng, Yu-Jing Liao, Chieh-Sheng Lin
  • Patent number: 9282668
    Abstract: An electronic apparatus including a housing, a first circuit board, a battery module, a display module and a second circuit board is provided. The housing has at least an opening and an accommodating space. The first circuit board is disposed in the accommodating space. The battery module is disposed in the accommodating space and stacked over the first circuit board. The display module is disposed in the accommodating space and stacked over the battery module, wherein the display module is visible through the opening. The second circuit board is disposed in the accommodating space and disposed under the display module, beside the battery module.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: March 8, 2016
    Assignee: HTC Corporation
    Inventors: Ying-Yen Cheng, Yu-Jing Liao
  • Publication number: 20160057326
    Abstract: A camera module is provided. The camera module includes a camera device and a support ring. The camera device includes a substrate, an image sensor device on the substrate, and a holder for covering the image sensor device, wherein the holder includes a side portion placed around the image sensor device. The support ring is fixed to and laterally extends from the side portion of the holder, and is attached onto a wall portion of the chassis. A portable device with the camera module is also disclosed.
    Type: Application
    Filed: October 30, 2015
    Publication date: February 25, 2016
    Applicant: HTC CORPORATION
    Inventors: Hsin-Chih LIU, Yu-Jing LIAO, Ying-Yen CHENG, Yin-Chou CHEN, I-Cheng CHUANG, Chia-Huan CHANG
  • Publication number: 20160050745
    Abstract: An electronic assembly includes an electronic module, a rigid board, a first flexible board, a second flexible board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connection end and a first pad arrangement at the first connection end. The first pad arrangement has a plurality of first pads. The second flexible board is connected to the rigid board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement has a plurality of second pads. The first pads are structurally and electrically connected to the second pads through the conductive adhesive layer.
    Type: Application
    Filed: August 15, 2014
    Publication date: February 18, 2016
    Inventors: Hsin-Chih Liu, Ying-Yen Cheng, Yu-Jing Liao
  • Patent number: 9210311
    Abstract: A camera module is provided. The camera module includes a camera device and a support ring. The camera device includes a substrate, an image sensor device on the substrate, and a holder for covering the image sensor device, wherein the holder includes a side portion placed around the image sensor device. The support ring is fixed to and laterally extends from the side portion of the holder, and is attached onto a wall portion of the chassis. A portable device with the camera module is also disclosed.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: December 8, 2015
    Assignee: HTC CORPORATION
    Inventors: Hsin-Chih Liu, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen, I-Cheng Chuang, Chia-Huan Chang
  • Publication number: 20150327413
    Abstract: An electronic apparatus including a housing, a motherboard, a battery and a display module is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery. The display module is disposed in the accommodating space and stacked over the battery. The battery is located between the motherboard and the display module. At least one edge of the battery in a width direction of the battery is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen
  • Patent number: 9184521
    Abstract: A connector assembly adapted to be disposed in a casing of an electronic device is provided. The connector assembly includes a connector and a locking member. The locking member includes a supporting portion and a holding portion connected to the supporting portion. The connector is disposed on the supporting portion. The locking member is adapted to clamp at an end of a substrate disposed in the casing, and the supporting portion and the holding portion lean against an upper side and a lower side of the end of the substrate respectively. An electronic device including the connector assembly aforementioned is also provided.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: November 10, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu
  • Patent number: 9137918
    Abstract: An electronic apparatus including a housing, a motherboard, a battery module and a display module is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery module is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery module. The display module is disposed in the accommodating space and stacked over the battery module. The battery module is located between the motherboard and the display module. At least one edge of the battery module in a width direction of the battery module is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: September 15, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen
  • Publication number: 20150200063
    Abstract: A switch structure and an electronic device using the same are provided. The electronic device has a casing, and the switch structure is disposed at an inner side of the key portion of the casing. The switch structure includes an elastic member, a force transmission member and a strain sensor. The elastic member is connected to the casing. The force transmission member is located inside the casing. The strain sensor is disposed on the elastic member, and the strain sensor and the force transmission member are disposed are two opposite sides of the elastic member respectively. The elastic member is configured to be deformed by the force transmission member when an external force is applied to an outside of the key portion.
    Type: Application
    Filed: January 13, 2014
    Publication date: July 16, 2015
    Applicant: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu, Hung-Wen Lin