Abstract: A package structure including a first redistribution layer, a semiconductor die, through insulator vias, an insulating encapsulant and a second redistribution layer. The first redistribution layer includes a dielectric layer, a conductive layer, and connecting portions electrically connected to the conductive layer. The dielectric layer has first and second surfaces, the connecting portions has a first side, a second side, and sidewalls joining the first side to the second side. The first side of the connecting portions is exposed from and coplanar with the first surface of the dielectric layer. The semiconductor die is disposed on the second surface of the dielectric layer. The through insulator vias are connected to the conductive layer. The insulating encapsulant is disposed on the dielectric layer and encapsulating the semiconductor die and the through insulator vias. The second redistribution layer is disposed on the semiconductor die and over the insulating encapsulant.

Abstract: A self-driven power generation module and a manufacturing method thereof are provided. The self-driven power generation module includes an upper structure, a lower structure, and a charge accumulation layer. The upper structure includes a first encapsulating layer, a first supporting layer, and a first electrode layer. The first supporting layer contacts the first encapsulating layer. The first electrode layer contacts the first supporting layer. The lower structure is spaced apart from the upper structure. The lower structure includes a second encapsulating layer, a second supporting layer, a second electrode layer, a third supporting layer, and a third electrode layer. The third supporting layer is disposed on the second encapsulating layer and spaced apart from the second supporting layer. The third electrode layer is disposed on the third supporting layer. The charge accumulation layer is disposed between the upper structure and the lower structure.

Abstract: A fingerprint identification device and a method for manufacturing the fingerprint identification device are provided. The fingerprint identification device includes a solder ball array, a re-distribution layer, an image sensing integrated circuit (IC), a light emitting circuit, a photic layer and a molding material. The re-distribution layer disposed on the solder ball array is electrically connected to a plurality of solder balls. The image sensing IC includes a plurality of through silicon vias (TSVs), and the TSVs are correspondingly electrically connected to the solder balls, respectively, through the re-distribution layer. The light emitting circuit is disposed on one side of the image sensing IC, and electrically connected to the image sensing IC through the re-distribution layer. The image sensing IC controls the light emitting circuit. The photic layer is disposed on the image sensing IC. The molding material encloses the image sensing IC.

Abstract: A fingerprint identification device and a method for manufacturing the fingerprint identification device are provided. The fingerprint identification device includes a solder ball array, a re-distribution layer, an image sensing integrated circuit (IC), a light emitting circuit, a photic layer and a molding material. The re-distribution layer disposed on the solder ball array is electrically connected to a plurality of solder balls. The image sensing IC includes a plurality of through silicon vias (TSVs), and the TSVs are correspondingly electrically connected to the solder balls, respectively, through the re-distribution layer. The light emitting circuit is disposed on one side of the image sensing IC, and electrically connected to the image sensing IC through the re-distribution layer. The image sensing IC controls the light emitting circuit. The photic layer is disposed on the image sensing IC. The molding material encloses the image sensing IC.

Abstract: A method for taking photo with an extension flash module of a mobile device is provided in the present invention. The mobile device operates in coordination with an extension flash module to achieve fill light while taking photo. The method includes the following steps: detecting a specific event before a flashable period. The flashable period starts from the time at which a last row of photo sensors begins exposure to the time at which a first row of photo sensors ends exposure. The time at which the specific event occurs is a fixed period of time compared to the flashable time. Then, triggering a flash instruction according to a flash delay time and a period from the time at which the specific event occurs to the flashable time, such that the extension flash module flashes during the flashable time.

Abstract: A method for taking photo with an extension flash module of a mobile device is provided in the present invention. The mobile device operates in coordination with an extension flash module to achieve fill light while taking photo. The method includes the following steps: detecting a specific event before a flashable period. The flashable period starts from the time at which a last row of photo sensors begins exposure to the time at which a first row of photo sensors ends exposure. The time at which the specific event occurs is a fixed period of time compared to the flashable time. Then, triggering a flash instruction according to a flash delay time and a period from the time at which the specific event occurs to the flashable time, such that the extension flash module flashes during the flashable time.