Abstract: A pump ring. The pump ring is suitable for a reaction chamber and capable for extracting gas from the reaction chamber in a uniform gas flow rate. The pump ring comprises a ring body and a top ring part located on the ring body. The top ring part is apart from an inner wall of the reaction chamber with a fixed distance. Therefore, a gas-extraction path composed of the reaction chamber, the ring body and the top ring part is unobstructed. Hence, the turbulence flow of the extracted gas can be efficiently suppressed and the problems of the accumulation of the impurities and reaction chamber contamination can be solved.

Abstract: An uninterruptible power supply (UPS) socket of the present invention consists of a front panel, an upper cover, a socket member, a wiring insulation plate, a battery set, a print circuit board assembly, a detachable lower cover, a power cord lead and several components. The upper and lower covers are connected via several electric conductive wires, and said print circuit board assembly contains a power circuit board, a control circuit board and a surge protection circuit board.

Abstract: A lift pin mechanism is applied to a process chamber for carrying a substrate and moving the substrate upward or downward. The mechanism includes a plurality of lift pins positioned in a plurality of through holes of a pedestal and a lift ring positioned below the lift pins. The lift pins are fixed on the lift ring perpendicularly and are smaller than the through holes so that the lift pins can move upward or downward in the through holes.

Abstract: A throttle valve connects with a chamber for adjusting air pressure in the chamber. The throttle valve has a housing having a channel in it, a piston ring positioned at an end of the channel, a stopper positioned in the channel, and a driver for rotating the stopper. The piston ring has a plane surface contacting with the housing, a first cambered surface contacting with the housing and vertically connecting with the plane surface, and a second cambered surface connecting with the first cambered surface. The second cambered surface of the piston ring contacts with a third cambered surface of the stopper.

Abstract: A modular power connector includes a plurality of insulating blocks consisting of a shielding integrated with a base, conductive plug poles, conductive receptacle poles, a plug shell, and a receptacle shell, wherein each insulating block is furnished on four sides of a base of an insulating block with two pairs of dovetails having first pair of a tenon and a motise on one side and the opposite side of the base of the insulating block, respectively, and a second pair of a tenon and a motise on the adjacent side and the opposite side of the base of the insulating block, respectively.

Abstract: An uninterruptible power supply (UPS) socket of the present invention consists of a front panel, an upper cover, a socket member, a wiring insulation plate, a battery set, a print circuit board assembly, a detachable lower cover, a power cord lead and several components, wherein said upper and lower covers were connected via several electric conductive wires, and said print circuit board assembly contains a power circuit board, a control circuit board and a surge protection circuit board.

Abstract: A rotatable cover plate assembly (10) has a cavity (13) and a rotatable base plate assembly (12) has a cavity (42) with a semiconductor wafer (14) mounted therein. The cover plate assembly (10) comes down onto the base plate assembly (12) enclosing the semiconductor wafer (14) and a dispenser (28) in a chamber formed by the cavities (13) and (42). The cover and base plates (16) and (40) are rotated as a single assembly, and coating material dispensed by the dispenser (28) onto the semiconductor wafer (14). A flow regulator (25) coupled via an exhaust manifold (20) controls the rate of evaporate of solvent from the dispensed coating material.

Abstract: A rotatable cover plate assembly 10 has a cavity 13 and a rotatable base plate assembly 12 has a cavity 42 with a semiconductor wafer 14 mounted therein. The cover plate assembly 10 comes down onto the base plate assembly 12 enclosing the semiconductor wafer 14 and a dispenser 28 in a chamber formed by the cavities 13 and 42. The cover and base plates 16 and 40 are rotated as a single assembly, and coating material dispensed by the dispenser 28 onto the semiconductor wafer 14. A flow regulator 25 coupled via an exhaust manifold 20 controls the rate of evaporate of solvent from the dispensed coating material.