Patents by Inventor Ying Ying HO

Ying Ying HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240085369
    Abstract: Disclosed is a self-powered formaldehyde sensing device, comprising: a triboelectric material electrode layer including a first substrate and a first electrode layer formed on the first substrate; a triboelectric material dielectric layer including a second substrate, a second electrode layer formed on the second substrate, a dielectric reacting layer formed on the second electrode layer, and a reaction modification layer formed on the dielectric reacting layer to surface-modify the dielectric reacting layer, the reaction modification layer being a phosphomolybdic acid complex (cPMA) layer, the phosphomolybdic acid complex of the phosphomolybdic acid complex layer being obtained by dissolving 4,4?-bipyridine (BPY) in isopropanol (IPA) and then mixing with phosphomolybdic acid (PMA) solution; an elastic spacer; and an external circuit.
    Type: Application
    Filed: December 21, 2022
    Publication date: March 14, 2024
    Applicant: National Taiwan University of Science and Technology
    Inventors: Chih-Yu Chang, Chun-Yi Ho, Yu-Hsuan Cheng, Ying-Ying Chen
  • Publication number: 20170182786
    Abstract: An example device in accordance with an aspect of the present disclosure includes a sensor die having a sensitive region and a bond pad. A bond is formed between a wire and the bond pad of the sensor die. An encapsulant is to retain the wire at the bond pad and mechanically support the wire and the bond, based on covering the bond and wire according to an encapsulant height, extending from the bond pad, greater than a bond height. The encapsulant is localized at the bond pad of the sensor die to enable the sensitive region to remain uncovered by the encapsulant.
    Type: Application
    Filed: February 4, 2014
    Publication date: June 29, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.
    Inventors: Emilio Angulo Navarro, Josiah CHAN, Fernando Bayona Alcolea, Albert Crespi Serrano, Mikel Zuza Irurueta, Jorge Castano, Ying Ying HO