Patents by Inventor Ying Ying

Ying Ying has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10693430
    Abstract: An audio signal processing method and an audio equalizer, both implemented in an embedded system without incurring excessive computation, use a Kaiser-Bessel-derived (KBD) window and an Overlap-and-Add (OLA) processing to eliminate signal distortion of a time domain audio signal during signal conversion and to generate filters according to audio effects desired by a user.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: June 23, 2020
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventor: Ying-Ying Chao
  • Publication number: 20200185299
    Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a semiconductor chip, a first mold compound layer at least partially covering the semiconductor chip, and a redistribution layer over the first mold compound layer, the redistribution layer including one or more electrically conductive lines in electrical connection with the semiconductor chip. The semiconductor package may additionally include a second mold compound layer over the redistribution layer, and an antenna array over the second mold compound layer, the antenna array configured to be coupled to the one or more electrically conductive lines.
    Type: Application
    Filed: June 8, 2017
    Publication date: June 11, 2020
    Inventors: Ka Fai CHANG, Yong HAN, David Soon Wee HO, Ying Ying LIM
  • Patent number: 10678414
    Abstract: A method, system, and/or computer program product adjust values of a plurality of conditions. A processor receives a user input, which is a movement across a user interface. A tendency of the movement, which describes a direction and velocity of the movement, is determined. According to the tendency of the movement, a processor adjusts a value of at least one of the plurality of conditions by using a plurality of graphs representing the plurality of conditions, where the plurality of conditions describe search criteria, and where the user input describes the search criteria.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: June 9, 2020
    Assignee: International Business Machines Corporation
    Inventors: Jian Wen Chi, Fang Liang Dong, Rong Rong Gong, Lin Ying Ying
  • Patent number: 10669394
    Abstract: A polyamide composition with improved melt flow containing (A) 20 to 99.9 wt % of one or more polyamides independently selected from the group consisting of aliphatic polyamide, semi-aromatic polyamide, aromatic polyamide and their blends, (B) 0.1 to 10 wt % of one or more polyether polyols having a melting temperature below room temperature, (C) 0 to 70 wt % of one or more reinforcing agents, and (D) 0 to 50 wt % of one or more other additives, each based on the whole composition. A molding article produced from the polyamide composition also is disclosed.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: June 2, 2020
    Assignee: BASF SE
    Inventors: Siqi Xue, Shu Kui Wang, Ying Ying Dai
  • Patent number: 10662325
    Abstract: The present invention relates to a polymer composition comprising a thermoplastic polyester and a propylene-based elastomer, wherein the propylene-based elastomer comprises propylene-derived units and 5 to 30 wt % of ?-olefin-derived units, and has a melting temperature of less than 120° C. and a heat of fusion of less than 75 J/g.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: May 26, 2020
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Ying Ying Sun, Yi Ping Ni, Pei Te Bao, Yi Zhou Shi, Xiaoyun Wang
  • Patent number: 10633527
    Abstract: Provided is a composition having 70 wt % to 90 wt % of a first propylene-olefin copolymer component having an ethylene content of 15 to 21 wt %; and 10 wt % to 30 wt % of a second propylene-olefin copolymer component having an ethylene content of 6 to 10 wt %; wherein the weight average molecular weight of the first component is 250,000 to 1,780,000 g/mol higher than the weight average molecular weight of the second component; wherein the reactivity ratio product of the first component is less than 0.75; wherein the reactivity ratio product of the second component is greater than or equal to 0.75.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: April 28, 2020
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Alexander I. Norman, Gregory K. Hall, John R. Hagadorn, Andy H. Tsou, Peijun Jiang, Ying Ying Sun, Sarah J. Mattler, Arturo Leyva
  • Publication number: 20200078304
    Abstract: The present invention generally relates to reducing the mucoadhesive properties of a particle. In some embodiments, the particle is coated with and/or associated with a (poly(ethylene glycol))-(poly(propylene oxide))-(poly(ethylene glycol)) triblock copolymer. Methods for preparing inventive particles using a poly(ethylene glycol)-vitamin E conjugate as a surfactant are also provided. In some embodiments, methods are provided comprising administering to a subject a composition of particles of the present invention. Such particles with reduced mucoadhesive properties are useful in delivering agents to mucosal tissues such as oral, ophthalmic, gastrointestinal, nasal, respiratory, and genital mucosal tissues.
    Type: Application
    Filed: July 12, 2019
    Publication date: March 12, 2020
    Inventors: Samuel K. Lai, Ming Yang, Ying-Ying Wang, Olcay Mert, Laura Ensign, Justin Hanes, Jie Fu
  • Patent number: 10586865
    Abstract: A dual-gate metal-oxide-semiconductor field-effect transistor (MOSFET) may include a MOSFET having a channel region, a drain, and a source, a first gate formed proximate to the channel region, a drain extension region formed proximate to the drain, and a second gate formed proximate to the drain extension region.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: March 10, 2020
    Assignee: Cirrus Logic, Inc.
    Inventors: Scott Warrick, Justin Dougherty, Alexander Barr, Christian Larsen, Marc L. Tarabbia, Ying Ying
  • Publication number: 20200061007
    Abstract: The present invention aims to provide a growth inhibitor for cancer stem cells resistant to existing anticancer drug therapies, which growth inhibitor acts on the cells through growth inhibition and apoptosis. The growth inhibitor for cancer stem cells contains a retinoid agonist, preferably tamibarotene, alone or in combination with a rexinoid agonist, preferably bexarotene, as an effective component(s). The growth inhibitor for cancer stem cells enhances the effects of various anticancer drugs when the growth inhibitor is used in combination with the anticancer drugs.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, TMRC Co., Ltd.
    Inventors: Akira KURISAKI, Ying Ying WANG, Hitomi TAKADA, Hisao EKIMOTO
  • Publication number: 20200046640
    Abstract: Nano-crystallized herbal ingredient-containing package for use in a food processor or being used directly to prepare an herbal decoction is provided. The nano-crystallized herbal ingredient-containing package comprises a housing; single or multiple herbal ingredient nano-crystals; one or more non-additive and anti-caking spacers for preventing from caking to block solvent flowing through the package towards said single or multiple herbal ingredient nano-crystals during processing by the food processor; and optionally one or more stabilizing agents for stabilizing said single or multiple herbal ingredient nano-crystals during nano-crystallization of the herbal ingredients and during preparation of said herbal decoction. A method of preparing a herbal decoction from the said package is also provided.
    Type: Application
    Filed: January 17, 2019
    Publication date: February 13, 2020
    Inventors: Chun Hay KO, Connie Sau Kuen KWOK, Chun Fai NG, Ka Man TSE, Ying Ying NG
  • Publication number: 20200044619
    Abstract: An audio signal processing method and an audio equalizer, both implemented in an embedded system without incurring excessive computation, use a Kaiser-Bessel-derived (KBD) window and an Overlap-and-Add (OLA) processing to eliminate signal distortion of a time domain audio signal during signal conversion and to generate filters according to audio effects desired by a user.
    Type: Application
    Filed: July 30, 2019
    Publication date: February 6, 2020
    Inventor: YING-YING CHAO
  • Publication number: 20200029372
    Abstract: This disclosure provides a computer-implemented process for an attachment process to a network. The method comprises, receiving a data request from a user equipment, connecting the user equipment is to a mobile communication network through a first base station, determining a router bound to the user equipment, connecting the router to the mobile communication network through a second base station, establishing a connection between the user equipment and the router through the first base station and the second base station.
    Type: Application
    Filed: July 23, 2018
    Publication date: January 23, 2020
    Inventors: Ying Ying Xu, ShengYan Sun, Jin Rong Wang, Yu Han Zhang, Ya Nan Mo, Xiao Hai Ma
  • Publication number: 20190393109
    Abstract: Semiconductor packages including package substrates having polymer-derived ceramic cores are described. In an example, a package substrate includes a core layer including a polymer-derived ceramic. The polymer-derived ceramic may include filler particles to control shrinkage and reduce warpage of the core layer during fabrication and use of the package substrate. The core layer may include counterbores or blind holes to embed a contact pad or an electrical interconnect in the core layer. A semiconductor die may be mounted on the package substrate and may be electrically connected to the contact pad or the electrical interconnect.
    Type: Application
    Filed: March 30, 2017
    Publication date: December 26, 2019
    Inventors: Lisa Ying Ying CHEN, Lauren Ashley LINK, Robert Alan MAY, Amruthavalli Pallavi ALUR, Kristof Kuwawi DARMAWIKARTA, Siddharth K. ALUR, Sri Ranga Sai BOYAPATI, Andrew James BROWN, Lilia MAY
  • Publication number: 20190369504
    Abstract: A method includes receiving a wafer, defining a plurality of zones over the wafer, performing a multi-zone alignment compensation for each of the plurality of zones according to an equation along a first direction to obtain a plurality of compensation values for each of the plurality of zones, and performing a wafer alignment and a lithography exposure for each of the plurality of zones according to the plurality of compensation values. The wafer alignment and the lithography exposure are performed zone-by-zone.
    Type: Application
    Filed: May 29, 2018
    Publication date: December 5, 2019
    Inventors: AI-JEN HUNG, YUNG-YAO LEE, HENG-HSIN LIU, CHIN-CHEN WANG, YING YING WANG
  • Patent number: 10403888
    Abstract: A method for manufacturing a negative electrode material of a lithium battery is provided. The method includes: covering a metal material and a carbon material on a surface of a silicon material; performing a thermal process for reacting the metal material with the carbon material on the surface of the silicon material thereby forming a silicon composite material and at least one projection on the surface of the silicon material, wherein a free end of the projection is extended to form a head, the silicon composite material is used as the negative electrode material of the lithium battery, the silicon composite material comprises a composite layer forming on the surface of the silicon material, and the composite layer comprises a metal silicide, a metal oxide, a silicon carbide and a silicon oxide.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: September 3, 2019
    Assignee: AUO Crystal Corporation
    Inventors: Han-Tu Lin, An-Li He, Ying-Ying Su, Chan-Tien Chen, Rong-Ruey Jeng, Kun-Fung Lin
  • Publication number: 20190256746
    Abstract: A process of heat shrinking an article is provided. The process includes shaping a thermoplastic vulcanizate (TPV) into an article, the TPV having: a partially vulcanized rubber dispersed in a continuous thermoplastic phase, wherein more than 5 wt % of the rubber is extractable in boiling xylene, and wherein the thermoplastic phase comprises a thermoplastic resin having a Tm>110° C. and a propylene-based elastomer (PBE) having a Tm<110° C.; and heating the article to a temperature between about 100° C. and 250° C. to shrink the article.
    Type: Application
    Filed: August 1, 2017
    Publication date: August 22, 2019
    Inventors: Wanli Wang, Michael W. Bednarik, Peite Bao, Yi Ping Ni, Ying Ying Sun
  • Patent number: 10344152
    Abstract: The present invention is related to a propylene-based injection molded composition made from a polymer blend comprising from 45 to 85 wt % of a polymer blend modifier having a weight average molecular weight of 10,000 to 100,000 g/mole and from 15 to 55 wt % of a propylene-based elastomer having a weight average molecular weight of from 100,000 to 300,000 g/mole, where the weight percent of the polymer blend modifier and the propylene-based elastomer are based on the total weight of the polymer blend. The polymer blend modifier comprises a first propylene-based polymer and a second propylene-based polymer, where the first and second propylene-based polymers are different and are individually selected from a homopolymer of propylene or a copolymer of propylene and ethylene or a C4 to C10 alpha-olefin.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: July 9, 2019
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Xin Chen, Ying Ying Sun, Yi Ping Ni, Pei Te Bao, Li Yuan, Jie Hui Xu
  • Publication number: 20190203957
    Abstract: A heat source unit for a refrigeration apparatus, includes: a casing; a heat exchanger disposed in an internal space of the casing, and that performs heat exchange between a refrigerant and air; a fan disposed in the internal space of the casing, and that horizontally blows out the air passing through the heat exchanger; and at least one shut-off valve having a connection port that opens toward a front-surface side or a rear-surface side of the casing; and peripheral panels that form a front surface, a rear surface, a left-side surface, and a right-side surface of the casing. The peripheral panels have a first portion that forms either one closer to the shut-off valve of the left-side surface or the right-side surface, and that has a cut-out portion.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 4, 2019
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Keiko Kobayashi, Ying Ying Ji
  • Publication number: 20190203988
    Abstract: A heat source unit for a refrigeration apparatus includes: a refrigerant circuit including a shut-off valve, a compressor, a heat exchanger, and a first refrigerant pipe positioned between the shut-off valve and the compressor; a fan that sends air to the heat exchanger; a casing that includes a side panel and that accommodates the refrigerant circuit and the fan; and a partitioning panel that partitions an internal space of the casing into a first space on the side panel side where the compressor is disposed, and a second space where the fan is disposed. The fan blows the air that has passed through the heat exchanger out to a front-surface side of the casing. The compressor, the shut-off valve, and the side panel are disposed in the stated order as the compressor, the shut-off valve, and the side panel as seen in a front view.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 4, 2019
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Keiko Kobayashi, Ying Ying Ji
  • Publication number: 20190203955
    Abstract: A heat source unit for a refrigeration apparatus, including: a casing; a heat exchanger disposed in an internal space of the casing, and that performs heat exchange between a refrigerant and air; a fan disposed in the internal space of the casing, and that horizontally blows out air passing through the heat exchanger; a first shut-off valve; and a second shut-off valve larger in diameter than the first shut-off valve; wherein the heat source unit further includes an above-shut-off-valves member disposed in the casing, positioned above the first shut-off valve and the second shut-off valve, and having at least one vertically penetrating wiring hole. The second shut-off valve is disposed below the first shut-off valve.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 4, 2019
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Keiko Kobayashi, Ying Ying Ji