Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: An electronic device with a mirror function and an image capture function comprises a body, a mirror display and an image capture unit. In this case, the mirror display is disposed in the body. The mirror display has a mirror plate and a display panel. The mirror plate is combined with the display panel or is disposed near the display panel. A semi-reflecting layer is disposed above the mirror plate. The image capture unit is disposed in the body.

Abstract: An electronic device with an auxiliary light includes a display module. The display module comprises a substrate, a display area and a light-emitting area. In this case, the substrate has a first surface and a second surface which is opposite to the first surface. The display area has a first electrode, an organic functional layer and a second electrode. The organic functional layer is sandwiched between the first electrode and the second electrode. The first electrode is disposed on the first surface of the substrate. The light-emitting area has a third electrode, an organic functional layer and a fourth electrode. The organic functional layer is sandwiched between the third electrode and the fourth electrode, the third electrode is disposed on the first surface or the second surface of the substrate.

Abstract: A display apparatus with a mirror function comprises a display and a semi-reflecting layer. The display includes a transparent substrate. The semi-reflecting layer is disposed on one surface of the transparent substrate. Furthermore, another display apparatus with a mirror function comprises a transparent substrate, a first electrode, a second electrode, an organic light-emitting portion, and a mirror plate. In this case, the first electrode is disposed on one side of the transparent substrate. The second electrode is disposed on the first electrode. The organic light-emitting portion is disposed between the first and second electrodes. The mirror plate is positioned on an opposite side of the transparent substrate, which is opposite to the side disposed with the first electrode.