Patents by Inventor Yingchao CUI

Yingchao CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11809088
    Abstract: A method of determining a control setting for a lithographic apparatus. The method includes obtaining a first correction for a current layer on a current substrate based on first metrology data associated with one or more previous substrates, and obtaining a second correction for the current layer on the current substrate. The second correction is based on a residual determined based on second metrology data associated with a previous layer on the current substrate. The method further includes determining the control setting for the lithographic apparatus for patterning the current layer on the current substrate by combining the first correction and the second correction.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: November 7, 2023
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Hadi Yagubizade, Min-Seok Kim, Yingchao Cui, Daan Maurits Slotboom, Jeonghyun Park, Jeroen Cottaar
  • Publication number: 20220334503
    Abstract: A method for determining lithographic matching performance includes obtaining first monitoring data from recurrent monitoring for stability control for an available EUV scanner. For a DUV scanner, second monitoring data is similarly obtained from recurrent monitoring for stability control. The EUV first monitoring data are in a first layout. The DUV second monitoring data are in a second layout. A cross-platform overlay matching performance between the first lithographic apparatus and the second lithographic apparatus is determined based on the first monitoring data and the second monitoring data. This is done by reconstructing the first and/or second monitoring data into a common layout to allow comparison of the first and second monitoring data.
    Type: Application
    Filed: August 11, 2020
    Publication date: October 20, 2022
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Yingchao CUI, Hadi YAGUBIZADE, Xiuhong WEI, Daan Maurits SLOTBOOM, Jeonghyun PARK, Sarathi ROY, Yichen ZHANG, Mohammad Reza KAMALI, Sang Uk KIM
  • Publication number: 20220334500
    Abstract: A method of determining a control setting for a lithographic apparatus. The method includes obtaining a first correction for a current layer on a current substrate based on first metrology data associated with one or more previous substrates, and obtaining a second correction for the current layer on the current substrate. The second correction is based on a residual determined based on second metrology data associated with a previous layer on the current substrate. The method further includes determining the control setting for the lithographic apparatus for patterning the current layer on the current substrate by combining the first correction and the second correction.
    Type: Application
    Filed: July 22, 2020
    Publication date: October 20, 2022
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Hadi YAGUBIZADE, Min-Seok KIM, Yingchao CUI, Daan Maurits SLOTBOOM, Jeonghyun PARK, Jeroen COTTAAR