Patents by Inventor Ying-Chih Lee

Ying-Chih Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240101602
    Abstract: Provided is a peptide and method in preventing or treating infections caused by a wide spectrum of pathogens, including bacteria and fungus in hosts such as plants and animals. Methods of preventing or treating plant diseases and infection in animals are also provided.
    Type: Application
    Filed: November 24, 2021
    Publication date: March 28, 2024
    Inventors: Rita P.Y. Chen, Chiu-Ping CHENG, Chien-Chih YANG, Kung-Ta LEE, Ying-Lien CHEN, Li-Hang Hsu, Hsin-Liang CHEN, Sung CHEN
  • Patent number: 11937370
    Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: March 19, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Publication number: 20180122749
    Abstract: A semiconductor wafer includes a substrate structure, a first insulation layer, a conductive layer and a second insulation layer. The substrate structure defines a via. The first insulation layer covers a surface of the substrate structure. The first insulation layer extends into the via, covers a lateral wall of the via and exposes a bottom surface at a bottom of the via. The conductive layer covers the first insulation layer and the bottom surface exposed by the first insulation layer. The second insulation layer covers the conductive layer. A warpage of the semiconductor wafer is less than 550 micrometers.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 3, 2018
    Inventors: Ying-Chih LEE, Chin-Cheng KUO, Yung-Hui WANG, Wei-Hong LAI, Chung-Ting WANG, Hsiao-Yen LEE
  • Patent number: 7924269
    Abstract: Display devices and methods forming the same. A digitizer sensor board is integrated on an upper substrate or a lower substrate of a display panel to provide a display device. In the display device, the display panel displays images, and the digitizer sensor board is integrated into the display panel to sense position of a position pointer or finger contact on a surface.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: April 12, 2011
    Assignee: TPO Displays Corp.
    Inventors: Din-Guo Chen, Ying-Chih Lee, Shyuan-Jeng Ho
  • Patent number: 7649525
    Abstract: Display systems with multifunctional digitizer module board. A shield film is integrated on a digitizer sensor board to form a multifunctional digitizer module board with lower thickness and weight. In the multifunctional digitizer module, a digitizer sensor board senses position of a position pointer or finger contact on a surface and a shield film is integrated on one surface of the digitizer sensor board by semiconductor process to screen out external noise. A display panel is disposed above the multifunctional digitizer module board and coupled thereto, displaying images.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: January 19, 2010
    Assignee: TPO Displays Corp.
    Inventors: Din-Guo Chen, Ying-Chih Lee
  • Patent number: 7552861
    Abstract: Display systems with digitizers. In a display system, an interface is coupled to a host system, and a control unit is coupled to a digitizer module, the display panel and the interface. The control unit drives the display panel to display a corresponding image and generates a scan timing signal to the digitizer module, according to an image signal from the host system via the interface. The digitizer module is coupled to the host system via the same interface and executes a scan operation to generate position data in response to the scan timing signal.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: June 30, 2009
    Assignee: TPO Displays Corp.
    Inventors: Ding-Guo Chen, Ying-Chih Lee
  • Publication number: 20070075977
    Abstract: Display systems with digitizers. In a display system, an interface is coupled to a host system, and a control unit is coupled to a digitizer module, the display panel and the interface. The control unit drives the display panel to display a corresponding image and generates a scan timing signal to the digitizer module, according to an image signal from the host system via the interface. The digitizer module is coupled to the host system via the same interface and executes a scan operation to generate position data in response to the scan timing signal.
    Type: Application
    Filed: October 4, 2005
    Publication date: April 5, 2007
    Inventors: Ding-Guo Chen, Ying-Chih Lee
  • Publication number: 20060146034
    Abstract: Display systems with multifunctional digitizer module board. A shield film is integrated on a digitizer sensor board to form a multifunctional digitizer module board with lower thickness and weight. In the multifunctional digitizer module, a digitizer sensor board senses position of a position pointer or finger contact on a surface and a shield film is integrated on one surface of the digitizer sensor board by semiconductor process to screen out external noise. A display panel is disposed above the multifunctional digitizer module board and coupled thereto, displaying images.
    Type: Application
    Filed: December 19, 2005
    Publication date: July 6, 2006
    Inventors: Din-Guo Chen, Ying-Chih Lee
  • Publication number: 20060146033
    Abstract: Display devices and methods forming the same. A digitizer sensor board is integrated on an upper substrate or a lower substrate of a display panel to provide a display device. In the display device, the display panel displays images, and the digitizer sensor board is integrated into the display panel to sense position of a position pointer or finger contact on a surface.
    Type: Application
    Filed: December 20, 2005
    Publication date: July 6, 2006
    Inventors: Din-Guo Chen, Ying-Chih Lee, Shyuan-Jeng Ho