Patents by Inventor Yingdong Ji

Yingdong Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250020688
    Abstract: A test socket for 224 Gbps ultra-high-speed coaxial testing includes a test socket body made of metal and a test socket cover plate. The test socket body is provided with mounting holes, within which are set first polymer positioning parts that match the holes. The first polymer positioning part is provided with first and second insertion holes, into which test probes are respectively inserted. The test socket cover plate is fixedly provided with a second polymer positioning part, which has a first positioning hole that matches the first polymer positioning part, and a second positioning hole that is connected to the first positioning hole and matches the end of the test probe. The height of the first polymer positioning part is less than the length of the test probe, achieving a large dynamic bandwidth and high isolation for the coaxial test socket for ultra-high-speed testing frequencies.
    Type: Application
    Filed: May 17, 2024
    Publication date: January 16, 2025
    Inventors: Yuanjun Shi, Lanyong Yin, Kai Liu, Yingdong Ji
  • Patent number: 8506307
    Abstract: An electrical connector and method of forming the same are provided, where the method can include affixing at least one layer to a core such that the layer is isomorphic to at least a portion of on an external surface of the core, press fitting the core with the layer into a socket cavity in a socket body, and removing the core from the socket cavity while leaving at least a portion of the layer so that the layer forms a shell layer affixed to an internal surface of the socket cavity. The method can further include inserting at least one plunger and a biasing device into a shell cavity so that a tail of the plunger is slidably received in the shell cavity and the biasing device biases a tip of the plunger away from an internal surface of the shell cavity.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: August 13, 2013
    Assignee: Interconnect Devices, Inc.
    Inventors: David Henry, Jiachun Zhou, Kanapathipillai Prabakaran, Yingdong Ji
  • Publication number: 20120142229
    Abstract: An electrical connector and method of forming the same are provided, where the method can include affixing at least one layer to a core such that the layer is isomorphic to at least a portion of on an external surface of the core, press fitting the core with the layer into a socket cavity in a socket body, and removing the core from the socket cavity while leaving at least a portion of the layer so that the layer forms a shell layer affixed to an internal surface of the socket cavity. The method can further include inserting at least one plunger and a biasing device into a shell cavity so that a tail of the plunger is slidably received in the shell cavity and the biasing device biases a tip of the plunger away from an internal surface of the shell cavity.
    Type: Application
    Filed: December 2, 2010
    Publication date: June 7, 2012
    Inventors: David Henry, Jiachun Zhou, Kanapathipillai Prabakaran, Yingdong Ji