Abstract: Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The package substrate includes a plurality of conductive bumps on a surface of the conductive line, where the conductive bumps are conductively coupled to the conductive line, and a solder resist over the conductive line and the dielectric. The surface of the conductive line may be a bottom surface, where the conductive bumps are below the conductive line and conductively coupled to the bottom surface of the conductive line, and where the conductive bumps may be embedded in the dielectric. The surface of the conductive line may be a top surface, where the conductive bumps are above the conductive line and conductively coupled to the top surface of the conductive line, and wherein the conductive bumps are embedded in the solder resist.

Abstract: A magnetic grounding technique implements a magnet assembly. The magnet assembly may be soldered to a component to facilitate grounding of a metal shield layer of a cable assembly. A cable plating may be plated onto an exposed part of the insulator of a cable assembly to form the cable assembly, and which galvanically contacts the metal shield layer of the cable assembly. The cable plating may comprise an electrically conductive and magnetic material to ensure magnetic attraction with the magnet assembly. The magnetic assembly is thus magnetically attracted to the cable plating, and also provides galvanic contact between the cable plating and, in turn, the metal shield layer of the cable and ground to reduce RFI. The magnet assembly also magnetically aligns the cable connection pins with those of a mating connector, thus reducing the strain placed on the connectors.

Abstract: Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

Abstract: Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

Abstract: Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

Abstract: Apparatus, systems, articles of manufacture, and methods for adaptive display control in virtual reality environments are disclosed. An example virtual reality display device for adaptive display control in a virtual reality environment includes memory and a processor to execute instructions to detect a first pupil size after a predetermined amount of time, determine a characteristic of a display image, identify a second pupil size from a plurality of pupil sizes correlated with the characteristic of the display image, perform a comparison of the first pupil size and the second pupil size, determine a margin of difference between the first pupil size and the second pupil size, and adjust the characteristic of the display image to change the first pupil size and reduce the margin difference.

Abstract: Apparatus, systems, articles of manufacture, and methods for adaptive display control in virtual reality environments are disclosed. An example virtual reality display device for adaptive display control in a virtual reality environment includes a scanner to detect a first size of a pupil of an eye of a user. The device also includes an analyzer to determine a first characteristic of a display image, reference a second pupil size based on the first characteristic of the display image, compare the first pupil size and the second pupil size, and adjust a second characteristic of the display image when the second pupil size is different than the first pupil size. The device also includes a display screen to present the second characteristic.

Abstract: Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The package substrate includes a plurality of conductive bumps on a surface of the conductive line, where the conductive bumps are conductively coupled to the conductive line, and a solder resist over the conductive line and the dielectric. The surface of the conductive line may be a bottom surface, where the conductive bumps are below the conductive line and conductively coupled to the bottom surface of the conductive line, and where the conductive bumps may be embedded in the dielectric. The surface of the conductive line may be a top surface, where the conductive bumps are above the conductive line and conductively coupled to the top surface of the conductive line, and wherein the conductive bumps are embedded in the solder resist.

Abstract: Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

Abstract: Embodiments herein relate to systems, apparatuses, processes or techniques directed to an impedance cushion coupled with a power plane to provide voltage for a system, where the impedance cushion is dimensioned to suppress resonance of the power plane to mitigate RFI or EMI emanating from the power plane during operation.

Abstract: A printed circuit board (PCB) includes a dielectric plane and a ground plane parallel to and spaced apart from the dielectric plane. The dielectric plane includes a pair of signal traces and a 3-dimensional (3D) grounded (GND) fence located between the pair of signal traces. The 3D GND fence is electrically connected to the ground plane, and protrudes perpendicularly from the dielectric plane. The 3D GND fence is located equidistant from each of the pair of signal traces, and the 3D GND fence is configured to block electromagnetic interference (EMI) from a first of the pair of signal traces to a second of the pair of the signal traces. The pair of signal traces is configured to form part of a noise-sensitive electronic circuit. The 3D GND fence may have a rectangular configuration.

Abstract: Apparatus, systems, articles of manufacture, and methods for adaptive display control in virtual reality environments are disclosed. An example virtual reality display device for adaptive display control in a virtual reality environment includes a scanner to detect a first size of a pupil of an eye of a user. The device also includes an analyzer to determine a first characteristic of a display image, reference a second pupil size based on the first characteristic of the display image, compare the first pupil size and the second pupil size, and adjust a second characteristic of the display image when the second pupil size is different than the first pupil size. The device also includes a display screen to present the second characteristic.

Abstract: Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.