Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: An optical transceiver module includes an outer cage, a socket member, a locking mechanism, and a release mechanism. The socket member is disposed removably in the outer cage. The locking mechanism is provided on the outer cage and the socket member, and serves to lock releasably the socket member to the outer cage. The release mechanism is mounted rotatably on the socket member, and is formed with a wedge part that is in sliding engagement with the locking mechanism such that rotation of the wedge part of the release mechanism relative to the socket member drives the locking mechanism between a locking state, where the socket member is locked to the outer cage, and an unlocking state, where the socket member is removable from the outer cage.

Abstract: A seismic-protection wheel locational anchorage is provided. The present seismic-protection wheel locational anchorage includes a first fastening member and a second fastening member. The first fastening member has a first horizontal part and a first perpendicular part vertically and downwardly extending from one end of the first horizontal part. The second fastening member has a second perpendicular part and a second horizontal part extending parallel from a lower end of the second perpendicular part. The first horizontal part of the first fastening member is fastened to the bottom of a machine frame. The second horizontal part is securely fastened to the ground. When the vertical level between the machine frame and the ground is appropriately adjusted, the first perpendicular part and the second perpendicular part are securely joined together so as to provide the seismic-protection wheel locational anchorage for the machine frame.

Abstract: Icariin-containing preparations obtained from the aerial parts of a plant of the genus Epimedium, comprising about 15% to about 95% icariin by weight and about 5% to about 80% non-icariin flavones by weight. Also disclosed are methods of obtaining such preparations from an Epimedium plant.