Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: Provided is a method for generating a chip probing wafer map, and the method includes: obtaining test data associated with a first chip, wherein the first chip includes a plurality of sequentially arranged first dies, and each of the first dies belongs to one of a plurality of bin numbers; assigning different predetermined color codes to the bin numbers; and generating a first general chip probing wafer map for the first chip by assigning a color code of each of the first dies as a corresponding predetermined color code according to the bin number to which each of the first dies belongs.

Abstract: A sensor chip assembly for use in a sensor capable of Surface Plasmon Resonance (SPR) and gravimetric sensing. The assembly comprising a transparent piezoelectric substrate (1) having a first surface and a second surface opposite to the first surface. The assembly also comprising first and second thin film metal electrodes (2,3) respectively provided on the first and second surfaces of the substrate (1). The second thin film metal electrode (3) being position on the second surface of the substrate (1) such that a light beam is capable of being transmitted through the second surface of the substrate and reflected from the first thin film metal electrode. The assembly also comprising an attenuated total reflection (ATR) coupler (11) disposed adjacent to the second thin film metal electrode (3).

Abstract: A sensor chip assembly for use in a sensor capable of Surface Plasmon Resonance (SPR) and gravimetric sensing. The assembly comprising a transparent piezoelectric substrate (I) having a first surface and a second surface opposite to the first surface. The assembly also comprising first and second thin film metal electrodes (2,3) respectively provided on the first and second surfaces of the substrate (1). The second thin film metal electrode (3) being position on the second surface of the substrate (1) such that a light beam is capable of being transmitted through the second surface of the substrate and reflected from the first thin film metal electrode. The assembly also comprising an attenuated total reflection (ATR) coupler (11) disposed adjacent to the second thin film metal electrode (3).