Abstract: A passivation layer is formed over an interconnect structure. An opening is etched at least partially through the passivation layer. A first conductive layer is deposited over the passivation layer. The first conductive layer partially fills the opening. An insulator layer is deposited over the first conductive layer. The insulator layer partially fills the opening. A second conductive layer is deposited over the insulator layer. The second conductive layer completely fills the opening. A first conductive structure is formed that is electrically coupled to the first conductive layer. A second conductive structure is formed that is electrically coupled to the second conductive layer.

Abstract: Provided is a method for generating a chip probing wafer map, and the method includes: obtaining test data associated with a first chip, wherein the first chip includes a plurality of sequentially arranged first dies, and each of the first dies belongs to one of a plurality of bin numbers; assigning different predetermined color codes to the bin numbers; and generating a first general chip probing wafer map for the first chip by assigning a color code of each of the first dies as a corresponding predetermined color code according to the bin number to which each of the first dies belongs.

Abstract: A sensor chip assembly for use in a sensor capable of Surface Plasmon Resonance (SPR) and gravimetric sensing. The assembly comprising a transparent piezoelectric substrate (1) having a first surface and a second surface opposite to the first surface. The assembly also comprising first and second thin film metal electrodes (2,3) respectively provided on the first and second surfaces of the substrate (1). The second thin film metal electrode (3) being position on the second surface of the substrate (1) such that a light beam is capable of being transmitted through the second surface of the substrate and reflected from the first thin film metal electrode. The assembly also comprising an attenuated total reflection (ATR) coupler (11) disposed adjacent to the second thin film metal electrode (3).

Abstract: A sensor chip assembly for use in a sensor capable of Surface Plasmon Resonance (SPR) and gravimetric sensing. The assembly comprising a transparent piezoelectric substrate (I) having a first surface and a second surface opposite to the first surface. The assembly also comprising first and second thin film metal electrodes (2,3) respectively provided on the first and second surfaces of the substrate (1). The second thin film metal electrode (3) being position on the second surface of the substrate (1) such that a light beam is capable of being transmitted through the second surface of the substrate and reflected from the first thin film metal electrode. The assembly also comprising an attenuated total reflection (ATR) coupler (11) disposed adjacent to the second thin film metal electrode (3).