Abstract: A wafer transfer system includes a wafer tray and a wafer separation assembly. The wafer tray includes a tray body and a center tray, a tray hole is formed at a center of the tray body penetrating the tray body in a thickness direction, and the center tray is disposed in the tray hole and is detachably placed at the tray body. The wafer separation assembly includes a tray support mechanism and a lifting mechanism, the tray support mechanism is used to support the tray body, the lifting mechanism is used to lift the center tray in the tray hole and to return the center tray back into the tray hole.

Abstract: The present disclosure provides a semiconductor process device and a wafer transfer system. The wafer transfer system includes a wafer tray and a wafer separation assembly. The wafer tray includes a tray body and a center tray, a tray hole is formed at a center of the tray body penetrating the tray body in a thickness direction, and the center tray is disposed in the tray hole and is detachably placed at the tray body. The wafer separation assembly includes a tray support mechanism and a lifting mechanism, the tray support mechanism is used to support the tray body, the lifting mechanism is used to lift the center tray in the tray hole and to return the center tray back into the tray hole. In the present disclosure, the lifting mechanism of the wafer separation assembly drives the center tray to rise and fall, such that the center tray lifts the wafer on the wafer tray or replaces the wafer.