Patents by Inventor Yingli SHI

Yingli SHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250019227
    Abstract: The embodiments of the present disclosure provide an MEMS device and an electronic device. The MEMS device includes: a base substrate; an electrode structure, which is located on the base substrate and includes a first ground electrode, a signal transmission electrode and a second ground electrode, which are sequentially arranged on the base substrate at intervals; a metal film bridge, which spans above the signal transmission electrode and forms a cavity with the signal transmission electrode, where two ends of the metal film bridge are respectively electrically connected to the first ground electrode and the second ground electrode; and a support structure, which is fixedly arranged with the metal film bridge, wherein the Young's modulus of the support structure is greater than the Young's modulus of the metal film bridge.
    Type: Application
    Filed: October 24, 2022
    Publication date: January 16, 2025
    Inventor: Yingli SHI
  • Publication number: 20240359973
    Abstract: A MEMS switch, a preparation method thereof, and an electronic apparatus. The MEMS switch includes: a substrate, a coplanar waveguide line structure disposed on a side of the substrate, an isolation structure disposed on a side of the coplanar waveguide line structure away from the substrate, a film bridge disposed on a side of the isolation structure away from the substrate. The coplanar waveguide line structure includes a first wire, a first DC bias line, a second wire, a second DC bias line and a third wire arranged at intervals sequentially. The second wire is one of an RF signal transmission line and a ground line, the first wire and the third wire are the other of the RF signal transmission line and the ground line. The film bridge is crossed between the first wire and third wire, and is connected with the first wire and the third wire respectively.
    Type: Application
    Filed: April 27, 2022
    Publication date: October 31, 2024
    Inventors: Yingli SHI, Chao ZHOU, Yanzhao LI
  • Publication number: 20240312730
    Abstract: The disclosure provides a micro-electromechanical system switch and a communication device. The micro-electromechanical system switch includes: a substrate; a DC bias line, arranged on one side of the substrate; a first signal transmission line and a second signal transmission line, arranged on the same side of the substrate as the DC bias line; a cantilever beam, arranged on a side, away from the substrate, of a layer on which the first signal transmission line is located; and a fixing structure, arranged on the side, away from the substrate, of the layer on which the first signal transmission line is located and not in contact with the first signal transmission line, where the fixing structure connects the free end and the substrate.
    Type: Application
    Filed: April 18, 2022
    Publication date: September 19, 2024
    Inventors: Yingli SHI, Yanzhao LI
  • Publication number: 20240291125
    Abstract: Provides are a phase shifter and a communication apparatus. The phase shifter includes a substrate; a signal transmission line on one side of the substrate; a first ground wire and a second ground wire on the same side of the substrate as the signal transmission line, the first and second ground wires are on two sides of the signal transmission line; and capacitance bridges on one side away from the substrate, of a layer where the signal transmission line is, the capacitance bridges are connected with the first and second ground wires, the capacitance bridges span the signal transmission line and are sequentially arrayed in an extension direction of signal transmission line, there is a gap between the capacitance bridges and the signal transmission line in a direction perpendicular to substrate, critical bias voltages are different when capacitance between the capacitance bridges and the signal transmission line reaches the maximum.
    Type: Application
    Filed: April 18, 2022
    Publication date: August 29, 2024
    Inventors: Yingli SHI, Yanzhao LI
  • Publication number: 20240279050
    Abstract: The present disclosure provides an MEMS switch device and an electronic apparatus. The MEMS switch device includes a base substrate, a membrane bridge structure, and a first ground line, a signal line and a second ground line sequentially arranged on a first side surface of the base substrate at intervals; the membrane bridge structure has a first end electrically connected to the first ground line, and a second end, opposite to the first end, electrically connected to the second ground line; and the membrane bridge structure includes a membrane bridge body structure and at least one protruding structure on the membrane bridge body structure, where the protruding structure protrudes from the membrane bridge body structure in a direction perpendicular to the first side surface of the base substrate.
    Type: Application
    Filed: June 29, 2022
    Publication date: August 22, 2024
    Inventors: Zibo CAO, Yingli SHI, Jingwen GUO, Chunxin LI, Qianhong WU, Jianyun ZHAO, Jianxing LIU, Feng QU
  • Publication number: 20240186095
    Abstract: The present disclosure provides a radio frequency micro-electro-mechanical switch and a radio frequency device, belong to the field of micro-electro-mechanical systems technology, and can at least partially solve a problem that functional performance of an existing radio frequency micro-electro-mechanical switch is easily to be affected in scenarios such as bending deformation of devices.
    Type: Application
    Filed: August 25, 2021
    Publication date: June 6, 2024
    Inventor: Yingli SHI
  • Publication number: 20240166496
    Abstract: The present disclosure provides a flexible MEMS switch, including an MEMS body and a packaging body outside the MEMS body, the packaging body includes a first flexible cover plate and a second flexible cover plate arranged at two opposite sides of the MEMS body respectively, a first cavity is formed between the first flexible cover plate and the MEMS body, and a second cavity is formed between the second flexible cover plate and the MEMS body. The present disclosure further provides a method for manufacturing the flexible MEMS switch.
    Type: Application
    Filed: June 3, 2021
    Publication date: May 23, 2024
    Inventor: Yingli SHI