Abstract: A projection device includes a housing and a bracket assembly. The housing has a first side wall and a second side wall connected to each other, the first side wall has a connecting portion and a limit groove, the limit groove has a curved section and a linear section connected to each other. The second side wall has a projection hole. The bracket assembly includes an adapter and a bracket. The adapter is movably connected to the connecting portion. The bracket is pivotally connected to the adapter and has a limit post extending into the limit groove. When the limit post moves to the linear section, the adapter is adapted to move in the connecting portion and drives the limit post to move in the linear section, so the bracket can be closer to the projection hole and the effect of covering the projection hole by the bracket is improved.

Abstract: A microfluidic detection unit comprises at least one fluid injection section, a fluid storage section and a detection section. Each fluid injection section defines a fluid outlet; the fluid storage section is in gas communication with the atmosphere and defines a fluid inlet; the detection section defines a first end in communication with the fluid outlet and a second end in communication with the fluid inlet. A height difference is defined between the fluid outlet and the fluid inlet along the direction of gravity. When a first fluid is injected from the at least one fluid injection section, the first fluid is driven by gravity to pass through the detection section and accumulate to form a droplet at the fluid inlet, such that a state of fluid pressure equilibrium of the first fluid is established.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: An identification system includes a modem and a dialog processing device in communication with a telephonic network to identify and classify a multiple of terminating connections. A classification algorithm attempts to establish an analog modem connection using the modem and also monitors operation of the dialog processing device. In response to the modem and the dialog processing device, a controller classifies the terminating connection then writes the type to the database. The classification algorithm will then loop back to the next terminating connection listed in the terminating connection field.

Abstract: A system and method of testing voice signals in a telecommunication system, such as a voice messaging system (VMS), are provided. A test signal is generated to elicit a response from the telecommunication system, and a voice signal produced by the telecommunication system in response to the test signal is detected. To evaluate the detected voice signal, the system accesses stored reference phrases, where one or more designated reference phrases can be combined to form an expected voice signal. The detected voice signal is compared with at least one designated reference phrase to determine if the detected voice signal substantially corresponds to the expected voice signal. In a preferred embodiment, the voice signal and reference phrases are divided into component frames of substantially equal time durations, then compared frame by frame to determine if the detected voice signal and the expected voice signal substantially correspond.

Abstract: A system and method for testing a telecommunication system, such as a voice messaging system (VMS) are provided. The system includes a processor for controlling the execution of test script commands used to direct testing of the telecommunication system, and a storage device is provided in communication with the processor for storing the test script commands. A directory in communication with the processor includes at least one service testing application associated with the telecommunication system and developed as a dynamic linked library (DLL). Contained within the service testing application are executable functions associated with the test script commands. A command engine in communication with the processor, storage device, and directory is operable to read the test script commands, scan the directory for the associated executable functions, and execute the associated executable functions.