Patents by Inventor Yinglong Li

Yinglong Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220277926
    Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.
    Type: Application
    Filed: August 25, 2020
    Publication date: September 1, 2022
    Applicant: ASML Netherlands B.V.
    Inventors: Yixiang WANG, Shibing LIU, Shanhui CAO, Kangsheng QIU, Juying DOU, Ying LUO, Yinglong LI, Qiang LI, Ronald VAN DER WILK, Jan-Gerard Cornelis VAN DER TOORN
  • Patent number: 11276593
    Abstract: Systems and methods to manipulate stacks of silicon wafers and rings are described. In one aspect, a robotic actuator includes a robotic end effector that further a first surface having multiple attached wafer suction cups arranged to collectively grasp a silicon wafer. The robotic end effector also includes a second surface that further includes multiple attached ring suction cups arranged to collectively grasp a ring. The second surface also includes a bulk grabber positionable to grasp a collective stack of rings. The robotic actuator also includes an axial actuator configured to rotate the robotic end effector about a flip axis, such that either the first surface or the second surface faces vertically upwards.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: March 15, 2022
    Assignee: Rorze Automation, Inc.
    Inventors: Royal Wallace Cherry, III, Omied Surendra Lele, Bernardo Gonzalez, Rahul Janardhan Chalmela, Yinglong Li
  • Publication number: 20210028038
    Abstract: Systems and methods to manipulate stacks of silicon wafers and rings are described. In one aspect, a robotic actuator includes a robotic end effector that further a first surface having multiple attached wafer suction cups arranged to collectively grasp a silicon wafer. The robotic end effector also includes a second surface that further includes multiple attached ring suction cups arranged to collectively grasp a ring. The second surface also includes a bulk grabber positionable to grasp a collective stack of rings. The robotic actuator also includes an axial actuator configured to rotate the robotic end effector about a flip axis, such that either the first surface or the second surface faces vertically upwards.
    Type: Application
    Filed: July 22, 2020
    Publication date: January 28, 2021
    Inventors: Royal Wallace Cherry III, Omied Surendra Lele, Bernardo Gonzalez, Rahul Janardhan Chalmela, Yinglong Li