Patents by Inventor Yingqian Zhang

Yingqian Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250102316
    Abstract: The present invention discloses an urban traffic velocity estimation method based on multi-source crowd sensing data. This method, based on roadside pedestrian data and road navigation data collected by smart phones, obtains a final estimated velocity through the steps of missing data filling, self-view velocity aggregation and multi-view velocity fusion. This fine-grained large-scale urban traffic velocity estimation method can achieve velocity estimation on all types of roads, including suburban road sections and paths, instead of just focusing on main roads in a city center. According to the present invention, based on data driving, the urban traffic velocity estimation method does not need to install additional devices on roads, and is low in cost and high in universality. Compared with the prior art, the urban traffic velocity estimation method has higher practicability, theoretical property and applicability, and is of great significance for improving traffic management and planning.
    Type: Application
    Filed: May 11, 2023
    Publication date: March 27, 2025
    Applicant: ZHEJIANG UNIVERSITY
    Inventors: Chao LI, Yingqian ZHANG, Shibo HE, Jiming CHEN, Yi FANG, Qinmin YANG, Peng CHENG
  • Publication number: 20230139725
    Abstract: A power module includes a first shell, a second shell, a circuit board assembly, and a heat dissipation encapsulation. The second shell is closed relative to the first shell and forms an accommodating space together with the first shell. The circuit board assembly is disposed in the accommodating space, and includes a circuit board body, a plurality of power components disposed on the circuit board body, and a plurality of electrical connectors electrically connected to the circuit board body. The electrical connectors are exposed from the first shell. The heat dissipation encapsulation is filled in the accommodating space and covers the circuit board assembly.
    Type: Application
    Filed: April 18, 2022
    Publication date: May 4, 2023
    Applicant: Lite-On Singapore Pte Ltd
    Inventors: Yijun Pan, Yingqian Zhang, Rayyan Bin Fairuz