Patents by Inventor Yingru Gu

Yingru Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050197048
    Abstract: A method for manufacturing a workpiece and a torque transducer module for material removal techniques, are disclosed, where machining friction varies in dependency of machining depth and the torque/deformation of a shaft is monitored for controlling material removal. The module has a body extending along a central axis and two end portions. Each end portion is part of an axial mount for a respective part to be axially mounted thereto. The module also includes a strain gage sensor arrangement with at least one electric output.
    Type: Application
    Filed: March 4, 2004
    Publication date: September 8, 2005
    Inventors: Leping Li, Werner Moser, Yingru Gu
  • Patent number: 6835117
    Abstract: A chemical-mechanical polishing (CMP) system and method includes pumping polishing slurry from a CMP apparatus through a sampling tube to an endpoint detection apparatus during a polishing operation, and flushing the sampling tube while a polishing operation is not in progress. The flushing of the sampling tube is commenced in accordance with a control signal from the endpoint detection apparatus terminating the polishing operation; the flushing is terminated in accordance with a starting signal to the CMP apparatus. The pump, which pumps a sample of slurry into the endpoint detection apparatus, continuously pumps slurry and/or water. Clogging of the slurry sampling tube is thus eliminated, thereby ensuring robust operation of the CMP apparatus. Contamination of the sampling tube is also avoided, so that the system may reliably provide sensitive endpoint detection and process control, even when a film of low pattern density is polished.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: December 28, 2004
    Assignee: International Business Machines Corporation
    Inventors: Xinhui Wang, Leping Li, Yingru Gu, Hung-Chin Guthrie
  • Patent number: 6741913
    Abstract: A method is described for noise reduction in a CMP endpoint detection system employing torque measurement. The torque signals are acquired using an adjustable sampling rate and sample size, and averaged using a moving array of adjustable size. By introducing these three adjustable quantities in the torque-based endpoint control algorithm and properly setting their values in the endpoint detection recipe, periodic noise associated with carrier rotation and carrier oscillation can be effectively removed. This in turn permits reliable, closed-loop control of the CMP process.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: May 25, 2004
    Assignee: International Business Machines Corporation
    Inventors: Xinhui Wang, Yingru Gu, Leping Li
  • Publication number: 20030109194
    Abstract: A method is described for noise reduction in a CMP endpoint detection system employing torque measurement. The torque signals are acquired using an adjustable sampling rate and sample size, and averaged using a moving array of adjustable size. By introducing these three adjustable quantities in the torque-based endpoint control algorithm and properly setting their values in the endpoint detection recipe, periodic noise associated with carrier rotation and carrier oscillation can be effectively removed. This in turn permits reliable, closed-loop control of the CMP process.
    Type: Application
    Filed: December 11, 2001
    Publication date: June 12, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xinhui Wang, Yingru Gu, Leping Li