Abstract: A resistance heater may include a polymer positive temperature coefficient (PPTC) material, arranged in a PPTC body defining a heater main surface. The PPTC material may include a polymer matrix, the polymer matrix defining the PPTC body, and a graphene filler component, disposed in the polymer matrix. The resistance heater may include an electrode assembly, comprising a first electrode and a second electrode arranged in contact with the heater body at two or more locations, a first lead, connected to the first electrode, and a second lead, connected to the second electrode. As such, the electrode assembly may define a current path between the first lead and the second lead, the current path comprising a first portion, extending along the heater main surface, and a second portion, extending through the heater body.

Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.

Abstract: A polymer positive temperature coefficient (PPTC) material may include a polymer matrix, the polymer matrix defining a PPTC body; and a graphene filler component, disposed in the polymer matrix, wherein the graphene filler component comprises a plurality of graphene particles aligned along a predetermined plane of the PPTC body.

Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.

Abstract: The present invention provides a conductive polymer composition, a conductive polymer sheet, an electrical device, and their preparation methods. The conductive polymer composition of the present invention includes a polymer and a conductive powder at a volume ratio of 35:65 to 65:35. The polymer includes at least one semicrystalline polymer selected from polyolefin, a copolymer of at least one olefin and at least one non-olefinic monomer copolymerizable therewith, and a thermoformable fluorine-containing polymer. The stated conductive powder includes at least one powder of a transition metal carbide, a transition metal carbon silicide, a transition metal carbon aluminide, and a transition metal carbon stannide. And the stated size distribution of the conductive powder satisfies: 20>D100/D50>6, where D50 denotes a corresponding particle size when a cumulative particle-size distribution percent in the conductive powder reaches 50%, and D100 denotes a maximum particle size.

Abstract: Disclosed is a reflow solderable positive temperature coefficient circuit protective device, comprising: an upper conductive blade terminal (1), which is composed of a first chip bonding portion (101), a first circuit bonding portion (105) and a connecting portion (103) therebetween, wherein the first chip bonding portion (101) has a first planar profile; a lower conductive blade terminal (2), which comprises a second chip bonding portion (201) having a second planar profile; a positive temperature coefficient chip, which is sandwiched between the upper conductive blade terminal (1) and the lower conductive blade terminal (2) and respectively bonded to the lower surface of the first chip bonding portion (101) and the upper surface of the second chip bonding portion (201) via solder, and has a third planar profile, wherein: the first planar profile and the second planar profile are in the interior of the third planar profile, and the third planar profile has portions that are not covered by the first planar pr

Abstract: A reflow solderable positive temperature coefficient circuit protection device is provided, the device comprising: an electrically conductive sheet-like upper terminal composed of a first chip junction portion, a first circuit junction portion, and a connection portion therebetween, wherein the first chip junction portion having a first planar profile; an electrically conductive sheet-like lower terminal comprising a second chip junction portion having a second planar profile; and a positive temperature coefficient chip which is sandwiched between the sheet-like upper terminal and the sheet-like lower terminal, and respectively combined with the lower surface of the first chip junction portion and the upper surface of the second chip junction portion by soldering, and the positive temperature coefficient chip having a third planar profile.

Abstract: The present invention provides a conductive polymer composition, a conductive polymer sheet, an electrical device, and their preparation methods. The conductive polymer composition of the present invention includes a polymer and a conductive powder at a volume ratio of 35:65 to 65:35. The polymer includes at least one semicrystalline polymer selected from polyolefin, a copolymer of at least one olefin and at least one non-olefinic monomer copolymerizable therewith, and a thermoformable fluorine-containing polymer. The stated conductive powder includes at least one powder of a transition metal carbide, a transition metal carbon silicide, a transition metal carbon aluminide, and a transition metal carbon stannide. And the stated size distribution of the conductive powder satisfies: 20>D100/D50>6, where D50 denotes a corresponding particle size when a cumulative particle-size distribution percent in the conductive powder reaches 50%, and D100 denotes a maximum particle size.