Patents by Inventor Yingwei Dai

Yingwei Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935634
    Abstract: A system for predicting and summarizing medical events from electronic health records includes a computer memory storing aggregated electronic health records from a multitude of patients of diverse age, health conditions, and demographics including medications, laboratory values, diagnoses, vital signs, and medical notes. The aggregated electronic health records are converted into a single standardized data structure format and ordered arrangement per patient, e.g., into a chronological order. A computer (or computer system) executes one or more deep learning models trained on the aggregated health records to predict one or more future clinical events and summarize pertinent past medical events related to the predicted events on an input electronic health record of a patient having the standardized data structure format and ordered into a chronological order.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: March 19, 2024
    Assignee: Google LLC
    Inventors: Alexander Mossin, Alvin Rajkomar, Eyal Oren, James Wilson, James Wexler, Patrik Sundberg, Andrew Dai, Yingwei Cui, Gregory Corrado, Hector Yee, Jacob Marcus, Jeffrey Dean, Benjamin Irvine, Kai Chen, Kun Zhang, Michaela Hardt, Xiaomi Sun, Nissan Hajaj, Peter Junteng Liu, Quoc Le, Xiaobing Liu, Yi Zhang
  • Patent number: 11925881
    Abstract: The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: March 12, 2024
    Assignee: ACM RESEARCH (SHANGHAI) INC.
    Inventors: Fuping Chen, Hui Wang, Xi Wang, Shena Jia, Danying Wang, Chaowei Jiang, Yingwei Dai, Jian Wang
  • Publication number: 20230223301
    Abstract: Embodiments of the present invention provide a method for removing a barrier layer of a metal interconnection on a wafer, which remove a single-layer metal ruthenium barrier layer. A method comprises: oxidizing step, is to oxidize the single-layer metal ruthenium barrier layer into a ruthenium oxide layer by electrochemical anodic oxidation process; oxide layer etching step, is to etch the ruthenium oxide layer with etching liquid to remove the ruthenium oxide layer.
    Type: Application
    Filed: May 31, 2021
    Publication date: July 13, 2023
    Applicant: ACM RESEARCH (SHANGHAI), INC.
    Inventors: Hui Wang, Hongwei Zhang, Yingwei Dai, Yinuo Jin, Jian Wang
  • Publication number: 20210236961
    Abstract: The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 5, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Fuping Chen, Hui Wang, Xi Wang, Shena Jia, Danying Wang, Chaowei Jiang, Yingwei Dai, Jian Wang
  • Patent number: 11000782
    Abstract: The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: May 11, 2021
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Fuping Chen, Hui Wang, Xi Wang, Shena Jia, Danying Wang, Chaowei Jiang, Yingwei Dai, Jian Wang
  • Publication number: 20180353876
    Abstract: The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned.
    Type: Application
    Filed: December 9, 2015
    Publication date: December 13, 2018
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Fuping Chen, Hui Wang, Xi Wang, Shena Jia, Danying Wang, Chaowei Jiang, Yingwei Dai, Jian Wang