Patents by Inventor Yingxuan ZHAO

Yingxuan ZHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11796738
    Abstract: The present invention provides a temperature-insensitive Mach-Zehnder interferometer, including: a first mode converter; a second mode converter, located on one side of the first mode converter and with a distance from the first mode converter; and a connecting arm, located between the first mode converter and the second mode converter, one end of the connecting arm is connected with the first mode converter, and the other end is connected with the second mode converter. The connecting arm includes a straight waveguide connecting arm. The temperature-insensitive Mach-Zehnder interferometer of the present invention can be configured to be insensitive to temperature by adjusting parameters such as the width and thickness of the connecting arm.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: October 24, 2023
    Assignee: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES
    Inventors: Chao Qiu, Yingxuan Zhao, Fuwan Gan, Aimin Wu, Zhen Sheng, Wei Li
  • Publication number: 20220120973
    Abstract: The present invention provides a temperature-insensitive Mach-Zehnder interferometer, including: a first mode converter; a second mode converter, located on one side of the first mode converter and with a distance from the first mode converter; and a connecting arm, located between the first mode converter and the second mode converter, one end of the connecting arm is connected with the first mode converter, and the other end is connected with the second mode converter. The connecting arm includes a straight waveguide connecting arm. The temperature-insensitive Mach-Zehnder interferometer of the present invention can be configured to be insensitive to temperature by adjusting parameters such as the width and thickness of the connecting arm.
    Type: Application
    Filed: January 3, 2019
    Publication date: April 21, 2022
    Applicant: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES
    Inventors: Chao QIU, Yingxuan ZHAO, Fuwan GAN, Aimin WU, Zhen SHENG, Wei LI