Patents by Inventor Yingying Du

Yingying Du has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12228601
    Abstract: The disclosure discloses a single-ended fault positioning method and system for a HVDC power transmission line based on a hybrid deep network. The method comprises the following: collecting rectification side bus output voltage and current signals of a HVDC power transmission system under different fault types, fault distances and transition resistances as an original data set; eliminating electromagnetic coupling of the bipolar direct-current line by using phase-mode transformation, extracting IMF components of fault voltage and current signals under different fault scenes by using variational mode decomposition, and calculating TEO of the IMF components to obtain a fault data set after feature engineering; normalizing the fault data set, and dividing the fault data set into a training set and a test set; and successively inputting the training set and the test set into a hybrid network of a convolutional neural network and a long short-term memory network for training and testing.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: February 18, 2025
    Assignee: WUHAN UNIVERSITY
    Inventors: Yigang He, Lei Wang, Lie Li, Yingying Zhao, Bolun Du, Liulu He
  • Patent number: 10786598
    Abstract: The present invention relates to a collagen-silk fibroin co-assembled sponge material, co-assembled artificial skin and a preparation method thereof. The collagen-silk fibroin co-assembled sponge material has an ordered porous spatial structure and is prepared from a collagen-silk fibroin co-assembled product obtained by co-assembly of collagen and silk fibroin. The co-assembled artificial skin comprises a collagen-silk fibroin co-assembled sponge dermis and an epidermis. The dermis of the co-assembled artificial skin provided in the present invention is similar to the natural extracellular matrix in composition and structure. This kind of ordered novel structure can induce ordered arrangement and regeneration of cells, thereby promoting wound healing, reducing scar formation and achieving good biocompatibility.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: September 29, 2020
    Assignee: ASIA BIOMATERIALS (WUHAN) CO., LTD.
    Inventors: Jianglin Wang, Hongchuan Ye, Zehui Liu, Yingying Du
  • Publication number: 20190282730
    Abstract: The present invention relates to a collagen-silk fibroin co-assembled sponge material, co-assembled artificial skin and a preparation method thereof. The collagen-silk fibroin co-assembled sponge material has an ordered porous spatial structure and is prepared from a collagen-silk fibroin co-assembled product obtained by co-assembly of collagen and silk fibroin. The co-assembled artificial skin comprises a collagen-silk fibroin co-assembled sponge dermis and an epidermis. The dermis of the co-assembled artificial skin provided in the present invention is similar to the natural extracellular matrix in composition and structure. This kind of ordered novel structure can induce ordered arrangement and regeneration of cells, thereby promoting wound healing, reducing scar formation and achieving good biocompatibility.
    Type: Application
    Filed: June 12, 2018
    Publication date: September 19, 2019
    Applicant: ASIA BIOMATERIALS (WUHAN) CO., LTD.
    Inventors: Jianglin WANG, Hongchuan YE, Zehui LIU, Yingying DU
  • Publication number: 20170290855
    Abstract: A silicate-doped hydroxyapatite material has an ordered and directional growth structure. The silicon content in the silicate-doped hydroxyapatite material ranges from 0.1 wt % to 1.6 wt %, and silicon is doped in hydroxyapatite lattices in a form of silicate. A template-induced method for manufacturing the synthetic silicate-doped hydroxyapatite material above.
    Type: Application
    Filed: January 13, 2017
    Publication date: October 12, 2017
    Inventors: Qin YANG, Yingying Du, Jianglin Wang