Patents by Inventor Yingying Fu

Yingying Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147134
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 2, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137684
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137683
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137682
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137689
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137687
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137693
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137692
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137690
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137681
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20230091004
    Abstract: Systems and methods for computer-assisted design of an inductor are described. Target specifications for an inductor are received. An inductor design is generated segment-by-segment using a reinforcement learning agent to generate segment parameters for each added segment. The reinforcement learning agent implements a policy that is learned using a reward computed based on performance of the generated inductor design relative to the target specifications. The generated inductor design is outputted as a candidate inductor design after determining that the generated inductor design satisfies a predefined performance threshold.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 23, 2023
    Inventors: Cameron Goeffrey Watmough HAIGH, Zichen ZHANG, Negar HASSANPOUR, Khurram JAVED, Jun LUO, Yingying FU
  • Patent number: 11513109
    Abstract: A biological toxicity test method for evaluating an ecological safety of an advanced oxidation process comprising the following steps: (1) collecting (preparing) a waste water to be determined; (2) collecting the waste water and a tap water after the advanced oxidation process treatment; (3) subjecting Koi (Cyprinus carpio haematopterus) to the water after treatment for exposure to poison; (4) Determining an anti-oxidation enzyme activity of a liver of the Koi after exposure; (5) Data analyzing. By comparing the changes of liver enzyme activities in different water, the present method evaluates the toxicity changes of micro-pollutant containing water before and after treatment, which fills in the gap of the ecological risk assessment for advanced oxidation technology.
    Type: Grant
    Filed: June 24, 2018
    Date of Patent: November 29, 2022
    Assignee: NANJING UNIVERSITY
    Inventors: Jinju Geng, Yingying Fu, Xingsheng Gao, Hongqiang Ren
  • Publication number: 20190271676
    Abstract: A biological toxicity test method for evaluating an ecological safety of an advanced oxidation process comprising the following steps: (1) collecting (preparing) a waste water to be determined; (2) collecting the waste water and a tap water after the advanced oxidation process treatment; (3) subjecting Koi (Cyprinus carpio haematopterus) to the water after treatment for exposure to poison; (4) Determining an anti-oxidation enzyme activity of a liver of the Koi after exposure; (5) Data analyzing. By comparing the changes of liver enzyme activities in different water, the present method evaluates the toxicity changes of micro-pollutant containing water before and after treatment, which fills in the gap of the ecological risk assessment for advanced oxidation technology.
    Type: Application
    Filed: June 24, 2018
    Publication date: September 5, 2019
    Inventors: JINJU GENG, YINGYING FU, XINGSHENG GAO, HONGQIANG REN
  • Publication number: 20180227001
    Abstract: A transmitter driver is disclosed. The transmitter driver includes first and second voltage mode drivers and a secondary data path. The secondary data path is connected in parallel with the first and second voltage mode drivers. A high frequency booster provides a high frequency path for boost current from the current source, to enable a high frequency voltage boost at the output ports.
    Type: Application
    Filed: February 6, 2017
    Publication date: August 9, 2018
    Inventors: Euhan Chong, Yingying Fu
  • Patent number: 10044377
    Abstract: A transmitter driver is disclosed. The transmitter driver includes first and second voltage mode drivers and a secondary data path. The secondary data path is connected in parallel with the first and second voltage mode drivers. A high frequency booster provides a high frequency path for boost current from the current source, to enable a high frequency voltage boost at the output ports.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: August 7, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Euhan Chong, Yingying Fu