Patents by Inventor Yingying Zhou

Yingying Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147134
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 2, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137684
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137683
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137681
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137689
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137687
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137693
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137690
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137692
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137682
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Patent number: 11928957
    Abstract: An audio visual haptic signal reconstruction method includes first utilizing a large-scale audio-visual database stored in a central cloud to learn knowledge, and transferring same to an edge node; then combining, by means of the edge node, a received audio-visual signal with knowledge in the central cloud, and fully mining semantic correlation and consistency between modals; and finally fusing the semantic features of the obtained audio and video signals and inputting the semantic features to a haptic generation network, thereby realizing the reconstruction of the haptic signal. The method effectively solves the problems that the number of audio and video signals of a multi-modal dataset is insufficient, and semantic tags cannot be added to all the audio-visual signals in a training dataset by means of manual annotation. Also, the semantic association between heterogeneous data of different modals are better mined, and the heterogeneity gap between modals are eliminated.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: March 12, 2024
    Assignee: NANJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS
    Inventors: Xin Wei, Liang Zhou, Yingying Shi, Zhe Zhang, Siqi Zhang
  • Patent number: 11656902
    Abstract: Disclosed in the present invention are a distributed container image construction scheduling system and method. The system includes a construction node and a management node. The construction node includes an image constructor for executing a construction task issued by the management node. The management node includes a console and a scheduler. The console is responsible for acquiring the relevant parameters such as a development dependency library and system configuration required by a user, and generating tasks with these parameters and sending same to the scheduler. The scheduler is used for receiving the tasks sent by the console, detecting the legitimacy of the tasks, and sending the tasks to the corresponding construction node to be run.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: May 23, 2023
    Inventors: Dengyin Zhang, Junjiang Li, Zijie Liu, Lin Zhu, Yi Cheng, Yingying Zhou, Zhaoxi Shi
  • Publication number: 20220171652
    Abstract: Disclosed in the present invention are a distributed container image construction scheduling system and method. The system includes a construction node and a management node. The construction node includes an image constructor for executing a construction task issued by the management node. The management node include, a console and a scheduler. The console is responsible for acquiring the relevant parameters such as a development dependency library and system configuration required by a user, and generating tasks with these parameters and sending same to the scheduler. The scheduler is used for receiving the tasks sent by the console, detecting the legitimacy of the tasks, and sending the tasks to the corresponding construction node to be run.
    Type: Application
    Filed: January 6, 2021
    Publication date: June 2, 2022
    Inventors: Dengyin ZHANG, Junjiang LI, Zijie LIU, Lin ZHU, Yi CHENG, Yingying ZHOU, Zhaoxi SHI
  • Publication number: 20070125361
    Abstract: A vent assembly that includes an intake member having an open end, an exhaust member, and a deflector. The exhaust member has an open end and extends coaxially with the intake member. The deflector is positioned along an interior surface of the intake member. The deflector defines a surface that slopes towards the open end of the intake member. The deflector is configured to direct liquid in the intake member towards the open end of the intake duct.
    Type: Application
    Filed: December 2, 2005
    Publication date: June 7, 2007
    Inventors: Bailey Black, Joel Hazelett, YingYing Zhou, John Boyer
  • Publication number: 20070042658
    Abstract: A fire resistant or acoustical article comprising a bast fiber component, a thermoplastic material that acts as a binder, and a first fire retardant component, the article having a coating of a second fire retardant component, such that the article may be used in the manufacture of structures having a Class A fire rating. According to one method of manufacture, a fibrous mass including a bast fiber component and a thermoplastic binder is heated and compressed to a desired thickness and density, followed by the dispersal of the first fire retardant there through, and coated with the second fire retardant component.
    Type: Application
    Filed: September 7, 2006
    Publication date: February 22, 2007
    Applicant: HNI Technologies Inc.
    Inventors: Anthony Cline, Steven Deaton, Steven Lee, Rusty Morehead, Rodney Thulen, YingYing Zhou
  • Patent number: 7074121
    Abstract: A vent assembly for use with a vent pipe assembly that includes an intake member defining an intake aperture and an exhaust member defining an exhaust aperture. The vent assembly may include a flow guide positioned adjacent to the intake aperture and configured to direct fluid flow into the intake aperture, a divider positioned between the exhaust aperture and the intake aperture and configured to minimize fluid flow between the exhaust aperture and the intake aperture, and a wind shield coupled to a distal end of the exhaust member adjacent to the exhaust aperture and configured to minimize reverse flow into the exhaust aperture. The vent assembly is configured to minimize the flow of fluids exhausted from the exhaust aperture into the intake aperture, to minimize reverse flow in the exhaust member, and to improve the flow of intake air into the intake aperture.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: July 11, 2006
    Inventors: Yingying Zhou, Dosun Shin, Brian Erickson
  • Publication number: 20060009146
    Abstract: A vent assembly for use with a vent pipe assembly that includes an intake member defining an intake aperture and an exhaust member defining an exhaust aperture. The vent assembly may include a flow guide positioned adjacent to the intake aperture and configured to direct fluid flow into the intake aperture, a divider positioned between the exhaust aperture and the intake aperture and configured to minimize fluid flow between the exhaust aperture and the intake aperture, and a wind shield coupled to a distal end of the exhaust member adjacent to the exhaust aperture and configured to minimize reverse flow into the exhaust aperture. The vent assembly is configured to minimize the flow of fluids exhausted from the exhaust aperture into the intake aperture, to minimize reverse flow in the exhaust member, and to improve the flow of intake air into the intake aperture.
    Type: Application
    Filed: July 7, 2004
    Publication date: January 12, 2006
    Inventors: Yingying Zhou, Dosun Shin, Brian Erickson