Patents by Inventor Yinhu Zhu

Yinhu Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEADSET, HEADSET ASSEMBLY, AND RELATED METHOD
    Publication number: 20240236544
    Abstract: This application discloses a headset, where the headset includes an ear housing and an earbud fastened to the ear housing, the earbud includes an earbud body and an SMA component embedded in the earbud body, and the earbud can automatically adjust a shape to adapt to a wearing environment. This application further discloses another headset, where the headset includes a headband and earmuffs connected to the headband, the earmuff includes an ear housing, an earpad fastened to the ear housing, and an SMA component embedded in the earpad, and the earpad can automatically adjust a shape to adapt to a wearing environment. The headset has high wearing comfort. This application further discloses a headset assembly including the foregoing headset and a related method.
    Type: Application
    Filed: February 26, 2022
    Publication date: July 11, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chengjie Shen, Dexin Xu, Yinhu Zhu, Xun Zhang
  • HEADSET, HEADSET ASSEMBLY, AND RELATED METHOD
    Publication number: 20240137686
    Abstract: This application discloses a headset, where the headset includes an ear housing and an earbud fastened to the ear housing, the earbud includes an earbud body and an SMA component embedded in the earbud body, and the earbud can automatically adjust a shape to adapt to a wearing environment. This application further discloses another headset, where the headset includes a headband and earmuffs connected to the headband, the earmuff includes an ear housing, an earpad fastened to the ear housing, and an SMA component embedded in the earpad, and the earpad can automatically adjust a shape to adapt to a wearing environment. The headset has high wearing comfort. This application further discloses a headset assembly including the foregoing headset and a related method.
    Type: Application
    Filed: February 26, 2022
    Publication date: April 25, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chengjie Shen, Dexin Xu, Yinhu Zhu, Xun Zhang