Abstract: A light-emitting device includes a light-emitting assembly and a light-transmissive component. The light-emitting assembly includes a first bracket, a light-emitting element, and a first photosensitive element. The first bracket has a first surface and a second surface opposite to each other. Multiple first electrodes and multiple second electrodes are disposed at intervals on the first surface, and the light-emitting element and the first photosensitive element are disposed at intervals on the second surface. The light-emitting element is electrically connected to at least one of the multiple first electrodes. The first photosensitive element is electrically connected to at least one of the multiple second electrodes.

Abstract: Provided is a method for manufacturing an optoelectronic device. The manufacturing method includes the following steps: In S1, a monolithic circuit board including multiple device units is manufactured. In S2, a chip is mounted on the first pad of the device unit, and the chip is electrically connected to the second pad so that a monolithic circuit board with the chip is obtained. In S3, the monolithic circuit board with the chip is encapsulated to obtain a monolithic optoelectronic device. In S4, the monolithic optoelectronic device is cut into individual optoelectronic devices. The method for manufacturing an optoelectronic device of the present disclosure can solve problems of substrate deformation and chips falling off and cracking during the manufacturing process of large-size and thin optoelectronic devices, thereby improving the yield rate.

Abstract: A lead frame for an optocoupler is provided, which is a metal sheet and includes multiple frame units and multiple mutually parallel connecting strips. The frame units are arranged at intervals on each of the connecting strips. Each of the frame units includes two adjacent functional parts, and two pins perpendicularly connected to the connecting strip. The two functional parts are both located on one side of the connecting strip and are respectively connected to the two pins and ends of the two pins are located on the other side of the connecting strip. The area of each of the functional parts is sufficient to accommodate a chip to be installed and fixed, and the chip is any one of a light-emitting chip and a light-sensing chip.

Abstract: Provided is an LED device. The LED device includes a bracket and a chip. The bracket includes a lead frame and a molded structure connected to the lead frame. The molded structure includes a chip placement body and a reflective structure. The chip placement body defines an avoidance groove. The reflective structure is a cylindrical structure with an inner through hole. The inner through hole communicates with the avoidance groove. The cylindrical structure is disposed around the periphery of the chip placement body. A first end of the cylindrical structure is formed with an opening communicating with the inner through hole. A second end of the cylindrical structure is connected to the chip placement body in the entire circumferential direction. A circumferential sidewall of the inner through hole forms a reflective surface used for reflecting light.

Abstract: Provided are a sensing device and a manufacturing method thereof. The sensing device includes a substrate, a red light chip, an infrared light chip, and a green light chip. The red light chip, the infrared light chip, and the green light chip are disposed on the front face of the substrate. Five front face pads are disposed on the front face of the substrate. Five back face pads are disposed on the back face of the substrate. The third back face pad is connected to the fourth back face pad by a conductive line. One of the five front face pads is electrically connected to a corresponding one of the five back face pads.